Heat dissipation design of printed circuit board
A printed circuit board and circuit board technology, which is applied to printed circuit components and other directions, can solve problems such as damaging system operation and affecting the working efficiency of electronic components, and achieve the effect of large heat dissipation area and good heat dissipation effect
Inactive Publication Date: 2019-05-14
金色慧能(宁波)储能技术有限公司
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Problems solved by technology
[0003] The printed circuit board is used as a fixed electronic component and can be electrically connected with the electronic component. The electronic components on the circuit board release a certain temperature during operation. If the heat dissipation is not proper, the working efficiency of the electronic component will be affected. even disrupt the operation of the system
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[0014] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0015] like Figure 1 to Figure 2 Shown: a heat dissipation design of a printed circuit board, including a circuit board body, the circuit board body includes a top surface and a bottom surface, the top surface is provided with lines, and the bottom surface is provided with a number of clustered tin points 1 .
[0016] Among the tin dots 1 distributed in clusters, a gap is reserved between two adjacent tin dots 1, and a plurality of air holes distributed in clusters are provided on the circuit board body.
[0017] The circuit board body includes a first copper plate layer 2, a second copper plate ...
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The invention discloses heat dissipation design of a printed circuit board. The heat dissipation design comprises a circuit board body, wherein the circuit board body comprises a top surface and a bottom surface; the top surface is provided with a circuit, and the bottom surface is provided with a plurality of tin points distributed in a cluster. The heat dissipation design is large in heat dissipation area and good in heat dissipation effect. Simply, the tin is high in heat dissipation effect and low in price, the tin points in the cluster distribution are used as a heat dissipation surface,and other electronic components are not arranged at the bottom of the circuit board body, so that the heat dissipation area is maximized; and in addition, the electronic element with the large heatingvalue is installed on the top surface of the circuit board body and corresponds to the position of the tin points distributed in the cluster, so that the heat dissipation effect is better.
Description
technical field [0001] The invention relates to the field of energy storage equipment manufacturing, in particular to a heat dissipation design of a printed circuit board. Background technique [0002] The printed circuit board is the provider of electrical connections for electronic components. Its development has a history of more than 100 years; its design is mainly layout design; the main advantage of using circuit boards is that it greatly reduces wiring and assembly errors, and improves automation and production labor rates. [0003] The printed circuit board is used as a fixed electronic component and can be electrically connected with the electronic component. The electronic components on the circuit board release a certain temperature during operation. If the heat dissipation is not proper, the working efficiency of the electronic component will be affected. Even disrupt the operation of the system. [0004] In order to solve the heat dissipation problem, the gene...
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IPC IPC(8): H05K1/02
Inventor 易涛陈强
Owner 金色慧能(宁波)储能技术有限公司