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Grinding apparatus

A technology of grinding and grinding surface, which is applied in the direction of grinding automatic control device, grinding workpiece support, grinding machine tool parts, etc., and can solve problems such as chip breakage, chip drop, and reduced flexural strength of device chips. achieve the effect of reducing the likelihood

Inactive Publication Date: 2019-05-17
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] However, when using the above-mentioned surface roughness measuring device, for example, when the wafer is transported from the grinding device to the surface roughness measuring device, the wafer may be dropped by mistake and the wafer may be damaged.
Moreover, the stylus of the surface roughness measuring device may also cause damage to the ground surface of the wafer, thereby reducing the flexural strength of the device chip.

Method used

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  • Grinding apparatus
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Embodiment Construction

[0015] An embodiment of one embodiment of the present invention will be described with reference to the drawings. figure 1 It is a perspective view which schematically shows the structural example of the grinding apparatus 2 of this embodiment. Such as figure 1 As shown, the grinding device 2 has a base 4 that supports each component. A wall-shaped support structure 6 is provided at the rear end of the base 4 . An opening 4 a is formed on the front side of the upper surface of the base 4 , and a conveying unit 8 for conveying a plate-shaped workpiece 11 is arranged in the opening 4 a.

[0016] The workpiece 11 is, for example, a disk-shaped wafer made of a material such as silicon (Si). However, the material, shape, structure, size, etc. of the workpiece 11 are not limited. For example, a substrate made of other materials such as semiconductors, ceramics, resins, and metals may be used as the workpiece 11 . And, also can be processed on the workpiece 11 and the ground sur...

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Abstract

The invention provides a grinding apparatus, which can reduce the possibility of damaging a processed object or damaging a ground surface when measuring the surface roughness. The grinding apparatus includes: a chuck table that holds a workpiece; a grinding unit that grinds the workpiece held by the chuck table; and a non-contact surface roughness measuring means for measuring, in a non-contact manner, the surface roughness of the surface to be ground of the workpiece ground by the grinding unit, the non-contact surface roughness measuring means comprising: a light emitting part for irradiating the surface to be ground with light; a light receiving unit that receives light reflected by the ground surface; a storage unit that stores the relationship between the amount of light received by the light receiving unit and the surface roughness of the ground surface; and a calculation unit that calculates the surface roughness of the ground surface on the basis of the relationship stored in the storage unit and the amount of light received by the light receiving unit.

Description

technical field [0001] The present invention relates to a grinding device used when grinding workpieces such as wafers. Background technique [0002] In order to reduce the size and weight of device chips incorporated into various electronic devices, etc., there are many opportunities to process wafers thinner before dividing into device chips. For example, the front side of the wafer on which the device is provided can be held by a chuck table, and the wafer can be ground by pushing a rotating grinder tool against the back side of the wafer to make the wafer thin (for example, see Patent Document 1). [0003] In addition, the flexural strength of device chips obtained by dividing a wafer thinned by grinding is closely related to the surface roughness of the ground surface (back surface) of the wafer. Therefore, after the wafer is ground, the surface roughness of the surface to be ground of the wafer is usually measured. The measurement of the surface roughness uses, for ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B7/20B24B27/00B24B41/00B24B41/06B24B49/12B24B51/00B24B57/02
CPCB24B49/12B24B7/228
Inventor 木村泰一朗
Owner DISCO CORP