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Cladding type tin-based liquid metal material for 120-160 DEG C heat dissipation

A liquid metal, coated technology, applied in the field of alloys, can solve problems such as no mature solutions, and achieve efficient heat dissipation

Inactive Publication Date: 2019-05-17
杭州辰卓科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Countries have invested a lot of manpower and material resources to carry out difficult explorations, but so far there is no mature plan

Method used

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  • Cladding type tin-based liquid metal material for 120-160 DEG C heat dissipation
  • Cladding type tin-based liquid metal material for 120-160 DEG C heat dissipation

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] A coated tin-based liquid metal material for heat dissipation at 120-160 degrees. In terms of weight percentage, the alloy composition is: Cr: 0.5wt.%, Si: 0.2wt.%, Ga: 0.6wt.%, Sb: 2.0wt.%, B: 0.2wt.%, Zn: 20.0wt. %, Te: 0.4wt.%, the balance is tin.

[0018] The preparation method of the above-mentioned heat dissipation material includes the following processing steps: (a) After the alloy is configured according to the required components, it is put into an induction furnace for melting, and is protected by a graphite crucible and argon; heat preservation at 400-500 degrees for 10 minutes After the alloy melt is fully stirred evenly by electromagnetic stirring, it is introduced into the graphite mold for casting; (b) The ingot is cold-rolled, and the reduction of each rolling pass is 15-20% until the required rolling is achieved. Thickness (0.1-0.5mm).

[0019] After the material is prepared into a foil-shaped thermal interface material, its use mode is as follows: ...

Embodiment 2

[0021] A coated tin-based liquid metal material for heat dissipation at 120-160 degrees. In terms of weight percentage, the composition of the alloy is: Cr: 0.8wt.%, Si: 0.4wt.%, Ga: 0.8wt.%, Sb: 3.0wt.%, B: 0.3wt.%, Zn: 30.0wt. %, Te: 0.5wt.%, the balance is tin.

[0022] The preparation method of the above-mentioned heat dissipation material includes the following processing steps: (a) After the alloy is configured according to the required components, it is put into an induction furnace for melting, and is protected by a graphite crucible and argon; heat preservation at 400-500 degrees for 10 minutes After the alloy melt is fully stirred evenly by electromagnetic stirring, it is introduced into the graphite mold for casting; (b) The ingot is cold-rolled, and the reduction of each rolling pass is 15-20% until the required rolling is achieved. Thickness (0.1-0.5mm).

[0023] After the material is prepared into a foil-shaped thermal interface material, its use mode is as fol...

Embodiment 3

[0025] A coated tin-based liquid metal material for heat dissipation at 120-160 degrees. In terms of weight percentage, the composition of the alloy is: Cr: 0.6wt.%, Si: 0.3wt.%, Ga: 0.6wt.%, Sb: 2.5wt.%, B: 0.2wt.%, Zn: 25.0wt. %, Te: 0.4wt.%, the balance is tin.

[0026]The preparation method of the above-mentioned heat dissipation material includes the following processing steps: (a) After the alloy is configured according to the required components, it is put into an induction furnace for melting, and is protected by a graphite crucible and argon; heat preservation at 400-500 degrees for 10 minutes After the alloy melt is fully stirred evenly by electromagnetic stirring, it is introduced into the graphite mold for casting; (b) The ingot is cold-rolled, and the reduction of each rolling pass is 15-20% until the required rolling is achieved. Thickness (0.1-0.5mm).

[0027] After the material is prepared into a foil-shaped thermal interface material, its use mode is as foll...

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Abstract

The invention discloses a cladding type tin-based liquid metal material for 120-160 DEG C heat dissipation. The cladding type tin-based liquid metal material for 120-160 DEG C heat dissipation comprises, by weight percentage, 0.5-0.8 wt.% of Cr, 0.2-0.4 wt.% of Si, 0.6-0.8 wt.% of Ga, 2.0-3.0 wt.% of Sb, 0.2-0.3 wt.% of B, 20.0-30.0 wt.% of Zn, 0.4-0.5 wt.% of Te and the balance tin. The novel heat dissipating material can form a solid base body to clad molten liquid metal under the using temperature, and the high grade heat dissipation solution needed in the electronic industry field can be solved. The technological development in the related field can also be promoted while the material is industrialized and acquires extremely great economic value.

Description

technical field [0001] The invention relates to the technical field of alloys, in particular to a tin alloy. Background technique [0002] With the rapid development of electronic technology, the volume of electronic devices tends to be miniaturized, and the complexity of the system is getting higher and higher. Since reliability and easy maintenance are also required, high thermal density heat dissipation is inevitable. This brings new challenges to the fabrication materials, processes and electronic circuits of electronic devices. In the process of heat dissipation design and selection of electronic devices, it is necessary to comprehensively consider the heat, quality and density of heat loss in electronic components. At the same time, in combination with the actual needs of electronic components and the entire electronics industry environment, different types of heat dissipation methods are integrated into one module to improve heat dissipation efficiency. [0003] Th...

Claims

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Application Information

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IPC IPC(8): C22C13/00C22C1/02
Inventor 刘亚军
Owner 杭州辰卓科技有限公司