Micro laser precision machining device

Abstract

The invention discloses a micro laser precision machining device. The micro laser precision machining device comprises a laser device, a visible light source, a plane mirror, a beam expanding collimator, a rotary prism, an optical window, a pressure fluid cavity and a nozzle micropore; a laser beam and a visible light beam which are coupled through the plane mirror are coaxial with the beam expanding collimator, the rotary prism, the optical window and the nozzle micropore; the laser device is a laser device of which the power range is from the watt grade to the hectowatt grade; the visible light source is a common white light source; and the beam expanding collimator is a beam expanding collimator which is of an inverted-telescope structure. According to the micro laser precision machining device, the defects that an existing water conduction laser system is high in coupling requirement for the laser focal point and the center point of a nozzle micropore, and detection is difficult are overcome, and the adaptability of the machining device to the surface flatness of a workpiece is high; and in addition, in the optical axis direction, precision focusing is not needed, parfocalization does not need to be considered, and ideal laser precision cutting, drilling and other machining can be achieved.

Description

technical field [0001] The utility model relates to a precision processing device, in particular to a micro-laser precision processing device. Background technique [0002] In traditional laser processing, the effective processing thickness of the workpiece is small, and the processing surface has problems such as taper and roughness. However, due to the use of the focusing lens, it is required to strictly couple the focal point of the focusing lens with the center of the microhole of the nozzle. In addition, the existing water-guided laser system There are disadvantages such as no visible light coaxial positioning indication, difficult system assembly and adjustment, inaccurate processing positioning, and inability to realize random detection. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a micro-laser precision machining device. [0004] The present invention solves the above-mentioned technical problems thr...

AI Technical Summary

Problems solved by technology

[0002] In traditional laser processing, the effective processing thickness of the workpiece is small, and the processing surface has problems such as taper and roughness. However, due to the use of the focusing lens, it is required to strictly couple the focal point of the focusing lens with the center of the microhole of the nozzle. In addition, the existing water-guided laser system There are disadvantages such as no visible light coaxial positioning indication, difficult system assembly and adjustment, imprecise processing positioning, and inability to realize random detection

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