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A mini-led high-speed crystal bonder and a crystal bond method
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A mini-led, die-bonding machine technology, used in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., can solve the problems of inconsistent viewing angle brightness, long consumption time, poor die-bonding consistency, etc. Crystal efficiency and precision, saving production space, compact structure
Active Publication Date: 2020-04-03
SHENZHEN XINYICHANG TECH CO LTD
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[0003] Die bonding machine is a device that can fix LED chips on the LED bracket. The traditional die bonding mechanism can only fix one chip at a time. As far as the chip usage of the micro-pitch display panel is concerned, this working method consumes It takes a long time and the consistency of die bonding is poor, so there are problems such as blurring, dead spots, and inconsistent brightness from different viewing angles.
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Embodiment 1
[0048] Embodiment 1: A mini-LED high-speed crystal bonder of the present invention, the crystal bonder includes:
[0049] Platen 1;
[0050] The feeding mechanism 2 and the receiving mechanism 3 are side-mounted on the left mounting plate and the right mounting plate of the platen 1 respectively;
[0051] The solid crystal machine also includes:
[0052] The track mechanism 4 is arranged between the feeding mechanism 2 and the receiving mechanism 3;
[0053] The lens assembly 5 is arranged on the rear side of the track mechanism 4;
[0054] The crystal frame moving platform 6 is arranged on the front side of the track mechanism 4;
[0055] The thimble assembly 7 is arranged below the wafer part placed on the crystal frame mobile platform 6;
[0056] The multi-head crystal-bonding mechanism 8 is arranged at the end of the track mechanism 4 and its crystal-bonding part is arranged above the set position of the track mechanism 4;
[0057] The feeding mechanism 2 is used to f...
Embodiment 2
[0067] Embodiment 2: A kind of crystal-bonding method of mini-LED high-speed crystal-bonding machine, this method comprises the following steps:
[0068] Step 1. First, the feeding mechanism 2 feeds the glued LED bracket A onto the track platform 4-1;
[0069] Step 2. Next, the system controls the jaw assembly 4-6 to move the bracket on the rail platform 4-1 to the top of the fixture platform 4-4, and the crystal-bonding lens assembly 5-2 cooperates with the jaw assembly 4-6 to drive the LED bracket to move to the solid crystal position;
[0070] Step 3. Next, the crystal lens assembly 5-1 cooperates with the crystal frame moving platform 6 to move the LED chip carried on the blue film 6-6 to the set position and correct it;
[0071] Step 4, the thimble assembly 7 ejects an LED chip located on the blue film 6-6;
[0072] Step 5, the die-bonding suction nozzle assembly 8-7 moves to the top of the LED chip through the third horizontal slide rail 8-2, the third vertical slide r...
Embodiment 3
[0078] In the present invention, the feeding mechanism 2, the track mechanism 4, the multi-head die-bonding mechanism 8 and the receiving mechanism 3 are arranged in a straight line, which makes the delivery of the LED bracket more convenient.
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Abstract
The invention discloses a mini-LED high-speed wafer fixing machine and a wafer fixing method. The wafer fixing machine comprises a table board, and a feeding mechanism and a receiving mechanism whichare laterally mounted on a left mounting plate and a right mounting plate of the table board respectively; the wafer fixing machine further comprises a track mechanism, a lens assembly, a wafer framemoving platform, an ejector pin assembly and a multi-head wafer fixing mechanism which are arranged on the board surface of the table board; the feeding mechanism is used for feeding an LED support into a material inlet of the track mechanism adjacent to the feeding mechanism; the track mechanism is used for receiving and transferring the LED support, and moving the LED support to a set position under the cooperation of the lens assembly; the ejector pin assembly ejects a wafer from the wafer frame moving platform, and then the multi-head wafer fixing mechanism is used for fixing the wafer tothe LED support; and the receiving mechanism is used for receiving the LED support subjected to wafer fixing. Compared with a conventional wafer fixing mode of fixing one wafer at a time, the wafer fixing machine has the advantages that a plurality of wafers can be fixed at a time by arranging a plurality of wafer fixing suction nozzles, so that the wafer fixing efficiency and precision are improved, and the consistency is guaranteed.
Description
technical field [0001] The invention relates to the technical field of automation equipment, and relates to an LED crystal bonding machine, in particular to a mini-LED high-speed crystal bonding machine and a crystal bonding method. Background technique [0002] A light emitting diode (Light Emitting Diode, LED) is a luminous element capable of converting electrical energy into light energy. LED products can be used in many fields such as lighting, display, and signal indication. In recent years, with the continuous improvement and improvement of LED packaging technology, for the display field, ultra-high-definition high-density small-pitch LED displays have the advantages of high response, high brightness, low power consumption, good chromaticity, and large viewing angles. There has been a tendency to replace traditional LCD displays. As LEDs for high-performance displays, the average chip usage per micro-pitch display panel has increased exponentially. [0003] Die bondi...
Claims
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Application Information
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