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Method and apparatus for process chamber cleaning endpoint detection

A technology for processing chambers and cleaning, applied in semiconductor/solid-state device testing/measurement, instruments, coatings, etc., can solve problems such as difficult to accurately determine when cleaning is completed

Active Publication Date: 2020-05-19
APPLIED MATERIALS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Regarding duration, it can be difficult to determine exactly when cleaning is complete

Method used

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  • Method and apparatus for process chamber cleaning endpoint detection
  • Method and apparatus for process chamber cleaning endpoint detection
  • Method and apparatus for process chamber cleaning endpoint detection

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Embodiment Construction

[0025] Embodiments of the invention relate to methods and apparatus for determining the endpoint of a processing chamber cleaning process. Embodiments of the method and apparatus may advantageously provide accurate endpoint detection of the cleaning process so that process chamber component wear from the cleaning process may be minimized while minimizing process drift and defects due to insufficient cleaning of the processing chamber. To facilitate an understanding of the principles of embodiments of the present invention, reference will now be made to the examples illustrated in the drawings and specific text will be used to describe the same. It should be understood, however, that the drawings and written description do not limit the scope of the invention, and any alternatives or further modifications of the illustrated embodiments and as described herein Any further application of the principles of the invention is contemplated herein.

[0026]Embodiments of the present i...

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Abstract

Embodiments provide systems, methods, and apparatus for detecting the cleaning endpoint of a cleaning process performed within a processing chamber. Embodiments include a spectrometer for measuring a time-varying spectral response of a cleaning reaction in a processing chamber during a cleaning process, and a lens system coupled to the spectrometer and positioned to focus in the processing chamber via a viewing port Selected areas of the sensor and zoom in on the radiation intensity from the selected area during the cleaning process. The selected area is selected based on the location predicted to be the last cleaning reaction during the cleaning process in the processing chamber (eg, a corner in a rectangular chamber). Several other aspects are provided.

Description

[0001] related application [0002] This application claims priority to U.S. Nonprovisional Patent Application No. 15 / 273,631, filed September 22, 2016, entitled "METHODS AND APPARATUS FORPROCESSING CHAMBER CLEANING END POINT DETECTION" (Attorney Docket No. 24312 / USA), issued The aforementioned application is hereby incorporated by reference for all purposes. technical field [0003] Embodiments of the present invention relate to electronic device processing chambers, and more particularly to methods and apparatus for chamber cleaning endpoint detection. Background technique [0004] Chemical vapor deposition (Chemical Vapor Deposition, CVD) is widely used in the semiconductor industry to deposit a variety of films, such as intrinsic and doped amorphous silicon (a-Si), silicon oxide (Si x o y ), silicon nitride (Si r N s ), silicon oxynitride, etc. Semiconductor chemical vapor deposition (CVD) processing is typically accomplished in a vacuum chamber using precursor gase...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67C23C16/44H01L21/02H01L21/66
CPCC23C16/4405C23C16/52H01J37/32963H01J37/32926H01J37/32853C23C16/50H01L21/67242H01L21/67028C23C16/44H01L21/0262H01L22/12G01N21/73C23C16/455G01N2201/06113H01J2237/335
Inventor 崔永镇周素镐朴范洙彭菲崔寿永
Owner APPLIED MATERIALS INC