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Active deformation compensation clamping device for ultra-precision cutting of soft and brittle ultra-thin crystals

A clamping device and active deformation technology, which is applied in the direction of fine working devices, manufacturing tools, stone processing equipment, etc., can solve the problems of inconsistent thickness and deformation of various points of the product, and achieve the improvement of ultra-precision cutting processing accuracy and high reliability , the effect of simple structure

Active Publication Date: 2020-05-19
BEIJING INSTITUTE OF TECHNOLOGYGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The purpose of the present invention is to solve the problem that the deformation of cesium iodide crystal CsI ultra-precision cutting process occurs during vacuum adsorption and fixation, resulting in inconsistent thickness of each point of the processed product, and to provide a method for ultra-precision cutting of soft and brittle ultra-thin crystals. active deformation compensation clamping device

Method used

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  • Active deformation compensation clamping device for ultra-precision cutting of soft and brittle ultra-thin crystals
  • Active deformation compensation clamping device for ultra-precision cutting of soft and brittle ultra-thin crystals
  • Active deformation compensation clamping device for ultra-precision cutting of soft and brittle ultra-thin crystals

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Embodiment 1

[0025] Active deformation compensation clamping device for ultra-precision cutting of soft and brittle ultra-thin crystals, which is fixedly installed above the vacuum suction cup in the single-point diamond ultra-precision lathe;

[0026] The clamping device includes a thin glass plate 1, a built-in electrode 2, a piezoelectric ceramic 3, a back electrode 4, a flexible support column 5, a deformation unit installation frame 6 and a voltage regulating circuit 7;

[0027] The installation frame 6 of the deformation unit is a two-body structure, and the two-body structure is assembled to form a concave-shaped structure, that is, there is a groove in the middle; the two-body structure is respectively equipped with a flexible support column 5; the built-in electrode 2 and the back electrode 4 respectively located on both sides of the piezoelectric ceramic 3, and then jointly fixed on the bottom surface of the glass sheet 1 to form a clamped part; the clamped part is fixed in the de...

Embodiment 2

[0035] combine Figure 5 To illustrate this embodiment, the cesium iodide crystal size is φ25.4mm×100μm, and the active deformation compensation clamping device includes a glass thin plate with a diameter of 50mm, a built-in electrode chemical deposition of 200μm, a piezoelectric ceramic PZT-5A, a back electrode, a flexible support column, Deformation unit mounting frame, vacuum suction cup, vacuum generator.

[0036] like Figure 5 a, Vacuum adsorption deformation is PV 3.711 wavelength without active compensation, such as Figure 5 b, The vacuum adsorption deformation after active compensation is PV 0.931 wavelength, which meets the needs of ultra-precision cutting.

[0037] The active deformation compensation clamping device for ultra-precision cutting of soft and brittle ultra-thin crystals of the present invention can be widely used in ultra-precision cutting of scintillation crystals.

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Abstract

The invention relates to an active deformation compensation clamping device used for ultra-precision cutting of soft brittle ultrathin crystals, and belongs to the field of scintillation crystal ultra-precision machining. The device can actively compensate for adsorption deforming difficultly avoided when a traditional vacuum suction cup sucks soft brittle ultrathin cesium iodide crystals, deterministic active compensation of absorbing deforming errors can be achieved, and the technical support is provided for reducing the crystal thickness and holding consistency of thicknesses of all pointsof the crystals during machining. Firstly, on the basis of static deformation principle, through analysis of an analytical expression of a dual-layer rectangular piezoelectric sheet influence functionunder the compact support condition, the influence function for reflecting the relation between the loading voltage and the deformation amount is built, and under assistance of high-precision surfaceshape detection devices like an interferometer, offline detection of vacuum absorption deforming is achieved, finally, through changing of excitation voltage of piezoelectric ceramic electrodes, theshape of a glass sheet layer is actively changed, the vacuum absorbing deforming is subjected to active deformation compensation, and ultra-precision cutting machining precision of the ultrathin cesium iodide crystals is improved.

Description

technical field [0001] The invention relates to an active deformation compensation clamping device for ultra-precision cutting of soft and brittle ultra-thin crystals, belonging to the field of ultra-precision machining of scintillation crystals. Background technique [0002] Cesium iodide crystal CsI belongs to the domain typical inorganic scintillation crystal. Inorganic scintillation crystals will emit ultraviolet or visible light after absorbing the energy of X-rays, γ-rays or other high-energy particles. Among them, CsI crystals have outstanding performance, and their emission spectrum can match that of silicon photodiodes. The length is shorter than that of NaI(Tl) crystal, the mechanical properties are good, the light yield of CsI crystal is high, and the production cost is relatively low. Wide range of detection applications. [0003] In the ultra-precision machining of cesium iodide crystal CsI, vacuum adsorption is generally used to clamp and position the crystal...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B28D5/00B28D7/04B28D7/00
Inventor 王姗姗张南生
Owner BEIJING INSTITUTE OF TECHNOLOGYGY
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