Mainboard upper cover of electronic equipment, its manufacturing method and electronic equipment

A technology for electronic equipment and motherboards, applied in the structure of telephones, etc., can solve problems such as reliability risks between assemblies and complex assembly processes of electronic equipment

Active Publication Date: 2021-04-27
VIVO MOBILE COMM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The embodiment of the present invention provides a main board cover of an electronic device, its manufacturing method, and the electronic device, which solve the problem that the decorative cover of the receiver is assembled on the electronic device in the current assembly method, the assembly process of the electronic device is complicated, and the risk of reliability between the assembly is prone to occur.

Method used

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  • Mainboard upper cover of electronic equipment, its manufacturing method and electronic equipment
  • Mainboard upper cover of electronic equipment, its manufacturing method and electronic equipment
  • Mainboard upper cover of electronic equipment, its manufacturing method and electronic equipment

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Embodiment Construction

[0024] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0025] see figure 1 , figure 2 , image 3 , Figure 4 and Figure 5 , which is a schematic diagram of the electronic device according to the first embodiment of the present invention, a schematic diagram of the upper cover of the motherboard, figure 2 The zoomed-in view of area A in the center and Figure 4 The enlarged view of the middle B area; as shown in the figure, the present embodiment provides an electronic device 1, the electronic devic...

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Abstract

The invention discloses a mainboard upper cover, its manufacturing method and electronic equipment. The mainboard upper cover has a decoration part and a sound outlet part connected to one side of the decoration part, and the sound outlet part includes a plurality of sound outlet holes. The manufacturing method of the upper cover of the main board is to firstly provide the forming mold of the upper cover of the main board, the forming die has the structures of the decoration part and the sound output part; and inject plastic into the forming die to form. Another manufacturing method is to firstly provide a structure with the decorative part and the sound outlet; set the structure into the molding mold of the main board cover; inject plastic into the molding mold, and the plastic will form the structure Formed by secondary overmolding. The present invention integrates the existing decorative cover of the receiver with the upper cover of the main board to reduce the assembly process of the electronic equipment, avoid the risk of reliability during assembly, and increase the sound volume of the electronic equipment.

Description

technical field [0001] The invention relates to the technical field of electronic equipment, in particular to a main board upper cover of an electronic equipment, a manufacturing method thereof and the electronic equipment. Background technique [0002] Consumers' pursuit of products is becoming more and more extreme, and the demand for sound effects of electronic devices (especially mobile phones) is getting higher and higher. We hope that the space design of the sound cavity channel will be large enough. The contradiction is that the pursuit of a full screen requires The exposed structural member area should be kept as small as possible. [0003] At present, electronic equipment is assembled with a receiver decorative cover on the decorative part and the sound output part of the main board cover. The receiver decorative cover is installed on the main board cover through assembly, which makes the assembly process of electronic equipment complicated and prone to reliability ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04M1/02H04M1/03
Inventor 李海宝
Owner VIVO MOBILE COMM CO LTD
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