Anisotropic conductive film

An anisotropic, conductive film technology, applied in the direction of conductive connections, conductive adhesives, conductive layers on insulating carriers, etc., to achieve the effects of reducing on-resistance, increasing direct contact area, and suppressing short circuits

Active Publication Date: 2019-06-04
DEXERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, increasing the density of conductive particles can cause short circuits

Method used

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  • Anisotropic conductive film
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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～10

[0154] (1) Manufacture of anisotropic conductive film

[0155] According to the compounding ratio shown in Table 1, the resin composition which forms an insulating resin layer and a low-viscosity insulating resin layer was prepared, respectively.

[0156] The resin composition for forming the insulating resin layer was coated on a PET film with a film thickness of 50 μm by a bar coater, and dried in an oven at 80° C. for 5 minutes to form an insulating resin layer with the thickness shown in Table 2 on the PET film. In the same manner, a low-viscosity insulating resin layer was formed on the PET film with the thickness shown in Table 2, respectively.

[0157] On the other hand, according to making the conductive particles with the insulating particles appear in plan view Figure 1A In the square lattice arrangement shown, the distance between particles is equal to the particle size of conductive particles with insulating particles, and the number density is 28,000 particles / mm...

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Abstract

This anisotropic conductive film, which is capable of reliably inhibiting the occurrence of a short circuit, while reducing the conduction resistance of a connection structure that is anisotropicallyconductively connected, has a structure wherein conductive particles 3 with insulating particles, each of which is obtained by having insulating particles 2 adhere to the surface of a conductive particle 1, are dispersed in an insulating resin layer 5. With respect to the conductive particles 3 with insulating particles in this anisotropic conductive film, the number of insulating particles 2 in contact with a conductive particle 1 in the film thickness direction is smaller than the number of insulating particles 2 in contact with the conductive particle 1 in the film surface direction. The number of insulating particles overlapping conductive particles in a plan view of one of the front and back surfaces of this anisotropic conductive film is preferably smaller than the number of insulating particles overlapping conductive particles in a plan view of the other surface.

Description

technical field [0001] The present invention relates to anisotropic conductive film Background technique [0002] Anisotropic conductive films are widely used for mounting electronic components such as IC chips. From the viewpoint of adapting the anisotropic conductive film to a high mounting density, the anisotropic conductive film has been performed to disperse conductive particles at a high density in the insulating resin layer. However, increasing the density of conductive particles can cause short circuits. [0003] In contrast, it has been proposed to use conductive particles with insulating particles, in which insulating particles are attached to the surface of conductive particles, instead of conventional conductive particles (Patent Document 1). An anisotropic conductive film can be obtained by kneading the electrically conductive particles with insulating particles and a binder resin using a mixer to form a film. [0004] prior art literature [0005] patent do...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01R11/01H01L21/60
CPCH01R11/01H01B13/0026H01B5/14H01L2224/32225H01L2224/271H01L2224/743H01L2224/2929H01L2224/29499H01L24/29H01L24/27H01L2224/29386H01L2924/05432H01L2924/00014H01L2924/061H01L2924/07025H01L2924/0665H01L2924/0695H01L2924/0675H01L2924/069H01L2924/0685H01L2924/05442C09J7/30C09J5/00C09J9/02C09J2203/326C09J2461/00C09J2463/00H01L24/83H01L2224/292H01L2224/29286H01L2224/83851
Inventor 三宅健塚尾怜司深谷达朗
Owner DEXERIALS CORP
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