System-level packaging structure with internal heat dissipation device
A technology of system-level packaging and heat dissipation device, which is applied in the direction of semiconductor/solid-state device components, semiconductor devices, electrical components, etc., can solve the problems of ineffective heat dissipation, limited reduction of thermal resistance, etc., to reduce stress and reduce thermal resistance , Improve the effect of heat dissipation conditions
Inactive Publication Date: 2019-06-07
XIAN MICROELECTRONICS TECH INST
View PDF5 Cites 8 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Since the heat can be exported through two different materials, the reduction of thermal resistance is limited, especially for some chips with high power consumption, this method cannot effectively solve the problem of heat dissipation
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment
[0024] see figure 2 , the shell of the present invention adopts ceramic packaging, the substrate 6 is bonded to the bottom of the inner cavity of the shell 1, and the chip 3 with large power consumption is welded on the substrate 6 after planting pillars. There are other laminated chips, resistors, capacitors, magnetic beads and other components. A thermal interface coating 5 is used to assemble a heat sink 4 on the chip 3, and the heat sink 4 and the cover plate 2 are made of the same material. A stress bend is designed at the place where the cover plate 2 is close to the Kovar frame to reduce the influence of stress caused by position mismatch.
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention discloses a system-level packaging structure with an internal heat dissipation device. Heat sinks are arranged on chips, and the heat sinks and a cover board are connected and adopt thesame material, so that besides an original downward heat dissipation channel which passes through a substrate shell of the chip, a heat dissipation channel from the heat sinks to the cover plate directly is also added. By adopting the packaging structure, the local heat source in a SiP module is provided with heat dissipation channels in the upper direction and the lower direction, so that the heat on the heat source of the chip can be effectively guided out, the heat resistance is reduced, and the heat dissipation condition is improved.
Description
technical field [0001] The invention belongs to the field of semiconductor hybrid integrated circuits, and in particular relates to a system-level packaging structure with an internal heat dissipation device. Background technique [0002] With the development of SiP technology, the assembly density of system-in-package products is getting higher and higher, and the wide application of large-scale processor chips in SiP products has led to a significant increase in power consumption per unit area. Carrying out reliable thermal design and reducing power consumption are problems that SiP products must solve. The current heat dissipation method is that a local heat source conducts heat to the shell through the substrate and the shell. Since the heat can be dissipated through two different materials, the reduction of thermal resistance is limited, especially for some chips with high power consumption, this method cannot effectively solve the problem of heat dissipation. Conten...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More IPC IPC(8): H01L23/373H01L23/367
CPCH01L2224/73265H01L2224/48091H01L2224/32145H01L2224/73253H01L2924/00014
Inventor 李昕郭清军杨宇军
Owner XIAN MICROELECTRONICS TECH INST