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System-level packaging structure with internal heat dissipation device

A technology of system-level packaging and heat dissipation device, which is applied in the direction of semiconductor/solid-state device components, semiconductor devices, electrical components, etc., can solve the problems of ineffective heat dissipation, limited reduction of thermal resistance, etc., to reduce stress and reduce thermal resistance , Improve the effect of heat dissipation conditions

Inactive Publication Date: 2019-06-07
XIAN MICROELECTRONICS TECH INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the heat can be exported through two different materials, the reduction of thermal resistance is limited, especially for some chips with high power consumption, this method cannot effectively solve the problem of heat dissipation

Method used

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  • System-level packaging structure with internal heat dissipation device
  • System-level packaging structure with internal heat dissipation device

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Embodiment

[0024] see figure 2 , the shell of the present invention adopts ceramic packaging, the substrate 6 is bonded to the bottom of the inner cavity of the shell 1, and the chip 3 with large power consumption is welded on the substrate 6 after planting pillars. There are other laminated chips, resistors, capacitors, magnetic beads and other components. A thermal interface coating 5 is used to assemble a heat sink 4 on the chip 3, and the heat sink 4 and the cover plate 2 are made of the same material. A stress bend is designed at the place where the cover plate 2 is close to the Kovar frame to reduce the influence of stress caused by position mismatch.

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Abstract

The invention discloses a system-level packaging structure with an internal heat dissipation device. Heat sinks are arranged on chips, and the heat sinks and a cover board are connected and adopt thesame material, so that besides an original downward heat dissipation channel which passes through a substrate shell of the chip, a heat dissipation channel from the heat sinks to the cover plate directly is also added. By adopting the packaging structure, the local heat source in a SiP module is provided with heat dissipation channels in the upper direction and the lower direction, so that the heat on the heat source of the chip can be effectively guided out, the heat resistance is reduced, and the heat dissipation condition is improved.

Description

technical field [0001] The invention belongs to the field of semiconductor hybrid integrated circuits, and in particular relates to a system-level packaging structure with an internal heat dissipation device. Background technique [0002] With the development of SiP technology, the assembly density of system-in-package products is getting higher and higher, and the wide application of large-scale processor chips in SiP products has led to a significant increase in power consumption per unit area. Carrying out reliable thermal design and reducing power consumption are problems that SiP products must solve. The current heat dissipation method is that a local heat source conducts heat to the shell through the substrate and the shell. Since the heat can be dissipated through two different materials, the reduction of thermal resistance is limited, especially for some chips with high power consumption, this method cannot effectively solve the problem of heat dissipation. Conten...

Claims

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Application Information

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IPC IPC(8): H01L23/373H01L23/367
CPCH01L2224/73265H01L2224/48091H01L2224/32145H01L2224/73253H01L2924/00014
Inventor 李昕郭清军杨宇军
Owner XIAN MICROELECTRONICS TECH INST
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