System-level packaging structure with internal heat dissipation device
A technology of system-level packaging and heat dissipation device, which is applied in the direction of semiconductor/solid-state device components, semiconductor devices, electrical components, etc., can solve the problems of ineffective heat dissipation, limited reduction of thermal resistance, etc., to reduce stress and reduce thermal resistance , Improve the effect of heat dissipation conditions
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[0024] See figure 2 The casing of the present invention adopts ceramic packaging, the substrate 6 is glued to the bottom of the inner cavity of the casing 1, the chip 3 with high power consumption is planted and welded on the substrate 6. There are other laminated chips, resistors, capacitors, and magnets inside the SiP. Beads and other components. The thermal interface coating 5 is used to assemble the heat sink 4 on the chip 3, and the heat sink 4 and the cover plate 2 are made of the same material. A stress curve is designed at the cover plate 2 near the Kovar frame to reduce the stress effect caused by position mismatch.
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