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Display module and preparation method thereof, and display device

A technology for display components and light-emitting modules, which is applied to electrical components, electric solid-state devices, semiconductor devices, etc., and can solve problems such as deviations, misalignment of light-emitting centers, and reduced light-emitting efficiency

Active Publication Date: 2019-06-07
HUIZHOU CHINA STAR OPTOELECTRONICS TECHNOLOGY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the prior art, during the packaging process, it is usually necessary to dispensing the light-emitting module, and use the high refractive index of the packaging colloid to use it as a lens to improve the light extraction efficiency, but in actual production, the packaging colloid formed The lens center and the light output center of the light-emitting module are often not aligned, and there is a deviation, which reduces the light output efficiency

Method used

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  • Display module and preparation method thereof, and display device
  • Display module and preparation method thereof, and display device
  • Display module and preparation method thereof, and display device

Examples

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Embodiment Construction

[0039] At present, when manufacturing display components, such as light emitting diode (light emitting diode, LED) chips, flip-chip LEDs are usually arranged directly on the bottom circuit board as a backlight source for liquid crystal displays (Liquid Crystal Display, LCD). Usually, the size of such a flip chip is small, about 100-300 microns, so it is called Mini-LED. After the Mini-LED is printed on the surface of the PCB, in order to protect it from external damage and water vapor corrosion, the PCB (Printed Circuit Board) and the surface of the LED will be covered with protective materials, which are generally polymer LED encapsulants. If the shape of the colloid on the surface of the chip is well controlled, the colloid can act as a lens due to the high refractive index of the colloid. When dotting encapsulating colloid on the surface of the LED to form a lens, because the colloid diffuses to the surroundings, and there is an error in the alignment when dispensing the gl...

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Abstract

The present application discloses a display module and a preparation method thereof, and a display device. The display module comprises: a bottom plate; a light-emitting module arranged on the bottomplate; an encapsulant arranged on the bottom plate and covering the light-emitting module, wherein a plurality of barrier layers are oppositely arranged at two sides of the light-emitting module, thebarrier layer is configured to fix the encapsulation position of the encapsulant to allow the central axis of the encapsulant to be overlapped with the central axis of the light-emitting module so asto align the center of a lens formed by the encapsulant with the light-emitting center of the light-emitting module and improve light emitting efficiency.

Description

technical field [0001] The present application relates to the field of display technology, in particular to a display component, a method for preparing the display component, and a display device. Background technique [0002] In recent years, as light emitting diode (LED) has many excellent characteristics such as self-illumination, low energy consumption, wide viewing angle, rich color, and fast response, it has aroused great interest in scientific research and industry, and is considered to be an extremely Potential display technology. [0003] In the prior art, during the packaging process, it is usually necessary to dispensing the light-emitting module, and using the high refractive index of the packaging colloid as a lens to improve the light extraction efficiency, but in actual production, the packaging colloid formed The lens center and the light output center of the light-emitting module are often not aligned, and there is a deviation, which reduces the light outpu...

Claims

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Application Information

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IPC IPC(8): H01L25/075H01L33/52H01L33/54H01L33/58G02F1/13357
Inventor 熊充张简圣哲
Owner HUIZHOU CHINA STAR OPTOELECTRONICS TECHNOLOGY CO LTD