Display module and preparation method thereof, and display device
A technology for display components and light-emitting modules, which is applied to electrical components, electric solid-state devices, semiconductor devices, etc., and can solve problems such as deviations, misalignment of light-emitting centers, and reduced light-emitting efficiency
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[0039] At present, when manufacturing display components, such as light emitting diode (light emitting diode, LED) chips, flip-chip LEDs are usually arranged directly on the bottom circuit board as a backlight source for liquid crystal displays (Liquid Crystal Display, LCD). Usually, the size of such a flip chip is small, about 100-300 microns, so it is called Mini-LED. After the Mini-LED is printed on the surface of the PCB, in order to protect it from external damage and water vapor corrosion, the PCB (Printed Circuit Board) and the surface of the LED will be covered with protective materials, which are generally polymer LED encapsulants. If the shape of the colloid on the surface of the chip is well controlled, the colloid can act as a lens due to the high refractive index of the colloid. When dotting encapsulating colloid on the surface of the LED to form a lens, because the colloid diffuses to the surroundings, and there is an error in the alignment when dispensing the gl...
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