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Holding equipment for holding circuit boards, etc.

A kind of equipment and retention technology, which is applied in the direction of circuit, printed circuit, printed circuit manufacturing, etc., can solve the problems of covering part or sticking part falling off, costly sticking or covering opening, wrong process of substrate, etc., so as to reduce time consumption and improve Printing accuracy, the effect of reducing the printing distance

Active Publication Date: 2021-10-19
NOTION SYSTEMS GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The disadvantage here is that regions on the processing table and openings in the substrate have to be glued or masked in a complex manner, which is extremely time-consuming especially in the case of large openings or in the case of a large number of smaller openings
Furthermore, the openings have to be removed in a complex manner after processing or machining
This creates a certain probability of damage to the processed substrate
In addition, adhesive residues can remain on the suction table, which must be removed in a complex manner prior to the processing of another substrate
Also, during the processing of the substrate, the corresponding cover or adhesive part may come off, which causes the substrate to be processed incorrectly and / or damages the corresponding processing equipment

Method used

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  • Holding equipment for holding circuit boards, etc.
  • Holding equipment for holding circuit boards, etc.
  • Holding equipment for holding circuit boards, etc.

Examples

Experimental program
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Effect test

Embodiment Construction

[0040] figure 1 A view from above shows a part of a holding device according to an embodiment of the invention.

[0041] exist figure 1 The holding device 1 is shown in plan view. The holding device 1 has a rectangular vacuum suction plate 2 with a suction surface 3 for the substrate. The vacuum suction plate can here also be circular, oval or also have any other shape. Adsorption ports 4 are arranged in the adsorption surface 3 , and the adsorption ports are arranged at certain intervals or evenly distributed on the adsorption surface 3 . A negative pressure is generated on the upper side of the vacuum suction plate 2 , by means of which vacuum the substrates arranged on the vacuum suction plate 2 are held in place. In addition, in figure 1 Suction zones 7a, 7b are exemplarily shown in , which can be controlled separately and which serve to hold the substrate in the respective zone 7a, 7b. The suction areas 7a, 7b can be defined and adjusted substantially freely not onl...

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PUM

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Abstract

The invention relates to a holding device for holding substrates, such as circuit boards, metal plates, films, etc., said holding device comprising a suction surface, wherein the suction surface has a plurality of suction nozzles and wherein the suction nozzles can be provided by means of a negative pressure supply device Loading a negative pressure relative to ambient pressure to provide a holding force for one or more substrates, wherein the negative pressure providing means provides a negative pressure such that the cumulative pressure drop from all adsorption nozzles and all adsorption nozzles and adsorption nozzles up to the negative pressure The proportion of the cumulative pressure drop of the feed line supplying the device is greater than 0.25%, in particular greater than 1%, preferably greater than 25%, especially greater than 35%, preferably greater than 40%.

Description

technical field [0001] The invention relates to a holding device for holding substrates, such as circuit boards, metal plates, films, etc., said holding device comprising a suction surface, wherein the suction surface has a plurality of suction nozzles and wherein the suction nozzles can be provided by means of a negative pressure supply device Loaded with a negative pressure relative to ambient pressure to provide retention for the one or more substrates. [0002] The invention also relates to a method for holding substrates, such as circuit boards, metal plates, films, etc., wherein one or more substrates are held by means of a suction surface, wherein the suction surface has a plurality of suction nozzles, and wherein the suction nozzles are loaded with Negative pressure relative to ambient pressure to provide retention for one or more substrates. [0003] The invention also relates to an inkjet printing device. Background technique [0004] Circuit boards, metal sheets...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B25B11/00H01L21/683
CPCB25B11/005H05K3/00H05K13/0069H05K2203/085H05K3/0085H05K2203/013H05K2203/0165
Inventor 延斯·明克尔扬·舍内费尔德迈克尔·多兰
Owner NOTION SYSTEMS GMBH
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