A silicon microresonant pressure sensor chip with double H-shaped tensile beams and its preparation method
A technology of pressure sensor and tension beam, which is applied in the measurement of the frequency change force of the stressed vibration element, the measurement of fluid pressure, the measurement of fluid pressure through electromagnetic components, etc., which can solve the problem of reducing the response speed of the sensor and increasing the difficulty of processing , Damage to the surface of the resonator, etc., to achieve the effect of reducing the additional stiffness and additional mass, reducing the difficulty of closed-loop control, and reducing the relative height difference
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[0048] The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments.
[0049] In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", " The orientation or positional relationship indicated by "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. are described based on the orientation or positional relationship shown in the drawings, and are only for convenience The description of the present invention and simplified description do not indicate or imply that the device or element referred to must have a specific orientation, or a specific orientation configuration and operation, and thus should not be construed as limiting the present invention.
[0050] refer to figure 1 and figure 2 , a silicon microresonant pressure sensor chip with double H-shaped tension beams includes a glass pressu...
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