Multi-layer flexible circuit board for shielding signal line and manufacturing method of multi-layer flexible circuit board

Abstract

The invention relates to the technical field of circuit board manufacturing, in particular to a multi-layer flexible circuit board for shielding a signal line and a manufacturing method of the multi-layer flexible circuit board. The manufacturing method of the multi-layer flexible circuit board for shielding the signal line is simple and convenient, and a single-sided flexible circuit board is directly pressed on the two surfaces of a double-sided flexible circuit board base material, a shielding thin film is laminated on the outermost layer, and meanwhile, an opening in the single-sided flexible circuit board is filled, so that the shielding thin film and a grounding wire area form metal wrapping on the signal line area, a high signal shielding effect is achieved, and loss of line signalsis reduced. According to the multi-layer flexible circuit board manufactured by the method for manufacturing the multi-layer flexible circuit board for shielding the signal line, the line signal lossis low, the overall thickness is thin, and the multi-layer flexible circuit board has relatively high bending performance.

Description

technical field [0001] The invention relates to the technical field of circuit board production, and more specifically, to a multilayer flexible circuit board with shielded signal lines and a production method thereof. Background technique [0002] With the birth and development of flexible circuit boards, flexible circuit boards have higher and higher requirements for signal transmission, especially in consumer electronics products for 5G applications, the smaller the signal loss of the circuit board, the better. In order to reduce the line signal loss, it is necessary to increase the thickness of the material, or use metal to shield the signal line. [0003] When making a multi-layer flexible circuit board with signal transmission requirements, consider reducing the loss of the line signal. Generally, the following two methods are used: (1) After the inner layer of the circuit board is made, it is directly pressed into a multi-layer board, and then the The multi-layer boa...

AI Technical Summary

Problems solved by technology

The thickness of the multi-layer flexible circuit board produced in this way is relatively thick, resulting in a decrease in the bending performance of the flexible circuit board; (2) After the inner circuit of the circuit board is completed, the circuit needs to be protected with a protective film (polyimide). Protection; While protecting the circuit, the ground layer is punched and opened with a mold, and the outer layer is connected to the copper foil in the inner layer ground line area by lamination with a signal shielding film

The multi-layer flexible circuit board made in this way will increase the cost of materials, and the process is more complicated

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