Multi-layer flexible circuit board for shielding signal line and manufacturing method of multi-layer flexible circuit board
A technology for flexible circuit boards and shielding signals, which is applied in the direction of printed circuit manufacturing, printed circuits, printed circuit components, etc., can solve the problem of increased material cost of multilayer flexible circuit boards, reduced bending performance of flexible circuit Thick board and other problems, to achieve good signal shielding effect, simple production method, low line signal loss effect
Active Publication Date: 2019-06-14
MFLEX YANCHENG CO LTD
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Problems solved by technology
The thickness of the multi-layer flexible circuit board produced in this way is relatively thick, resulting in a decrease in the bending performance of the flexible circuit board; (2) After the inner circuit of the circuit board is completed, the circuit needs to be protected with a protective film (polyimide). Protection; While protecting the circuit, the ground layer is punched and opened with a mold, and the outer layer is connected to the copper foil in the inner layer ground line area by lamination with a signal shielding film
The multi-layer flexible circuit board made in this way will increase the cost of materials, and the process is more complicated
Method used
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[0026] The present invention will be further described below in combination with specific embodiments. Wherein, the accompanying drawings are only for illustrative purposes, showing only schematic diagrams, rather than physical drawings, and should not be construed as limitations on this patent; in order to better illustrate the embodiments of the present invention, some parts of the accompanying drawings will be omitted, Enlargement or reduction does not represent the size of the actual product; for those skilled in the art, it is understandable that certain known structures and their descriptions in the drawings may be omitted.
[0027] An embodiment of the multilayer flexible circuit board for shielding signal lines of the present invention includes a double-sided flexible circuit board substrate 1, two single-sided flexible circuit boards 2 and a shielding structure.
[0028] Such as figure 1 As shown, the upper and lower sides of the base material of the double-sided fle...
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The invention relates to the technical field of circuit board manufacturing, in particular to a multi-layer flexible circuit board for shielding a signal line and a manufacturing method of the multi-layer flexible circuit board. The manufacturing method of the multi-layer flexible circuit board for shielding the signal line is simple and convenient, and a single-sided flexible circuit board is directly pressed on the two surfaces of a double-sided flexible circuit board base material, a shielding thin film is laminated on the outermost layer, and meanwhile, an opening in the single-sided flexible circuit board is filled, so that the shielding thin film and a grounding wire area form metal wrapping on the signal line area, a high signal shielding effect is achieved, and loss of line signalsis reduced. According to the multi-layer flexible circuit board manufactured by the method for manufacturing the multi-layer flexible circuit board for shielding the signal line, the line signal lossis low, the overall thickness is thin, and the multi-layer flexible circuit board has relatively high bending performance.
Description
technical field [0001] The invention relates to the technical field of circuit board production, and more specifically, to a multilayer flexible circuit board with shielded signal lines and a production method thereof. Background technique [0002] With the birth and development of flexible circuit boards, flexible circuit boards have higher and higher requirements for signal transmission, especially in consumer electronics products for 5G applications, the smaller the signal loss of the circuit board, the better. In order to reduce the line signal loss, it is necessary to increase the thickness of the material, or use metal to shield the signal line. [0003] When making a multi-layer flexible circuit board with signal transmission requirements, consider reducing the loss of the line signal. Generally, the following two methods are used: (1) After the inner layer of the circuit board is made, it is directly pressed into a multi-layer board, and then the The multi-layer boa...
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IPC IPC(8): H05K1/02H05K3/00H05K3/18
Inventor 唐晓锋
Owner MFLEX YANCHENG CO LTD
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