Satellite type die-cutting device
A die-cutting and satellite technology, applied in metal processing and other directions, can solve the problems of slow die-cutting speed and small radial load bearing capacity.
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- Publication Date
- 2019-06-18
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Abstract
Description
technical field
[0001] The invention belongs to the technical field of die-cutting machines, in particular to a satellite-type die-cutting device. Background technique
[0002] The die-cutting machine is mainly used for die-cutting various shapes of single-sided and double-sided stickers, protective films, gaskets, dust-proof nets, copper and aluminum foils, etc., especially for multi-layer composite products, which can be formed at one time. At present, the cutter mechanism of a die-cutting machine usually includes a base, a cutter and a pressure roller rotatably mounted on the base, and a plurality of cutter mechanisms arranged in sequence along the horizontal direction are arranged on the die-cutting machine. The main problem is that the rotation speed of the existing cutter mechanism is relatively low and the radial load that can be carried is relatively small, which seriously reduces the die-cutting efficiency; and when multiple cutter mechanisms work at the same time, ...
Examples
Embodiment Construction
[0019] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0020] figure 1 and figure 2 It is a schematic structural diagram of a satellite die-cutting device according to an embodiment of the present invention, wherein, figure 1 A schematic diagram showing a three-dimensional structure of a satellite die-cutting device according to an embodiment of the present invention, figure 2 A schematic cross-sectional structure diagram of the satellite die-cutting device of the present invention is shown. For the convenience of expression, only the parts related to the embodiment of the present invention are shown in the figure.
[0021] Depend on figure 1 and...