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HDI board fabrication method and HDI board

A manufacturing method and core board technology are applied in the direction of multilayer circuit manufacturing, electrical connection formation of printed components, electrical connection of printed components, etc., which can solve the problems of low production efficiency and long process flow of HDI boards, and achieve improved production efficiency and filling High pore efficiency and good surface stability

Inactive Publication Date: 2019-06-21
深圳明阳电路科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, for the production process of HDI boards, in the known technology, the conventional lamination process is used for production, and the process flow is extremely long, resulting in a very low production efficiency of HDI boards. Therefore, it is urgent to improve this problem.

Method used

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  • HDI board fabrication method and HDI board
  • HDI board fabrication method and HDI board
  • HDI board fabrication method and HDI board

Examples

Experimental program
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Effect test

Embodiment 1

[0042] A kind of HDI plate manufacturing method, refer to figure 1 , figure 1 It is a method flowchart of a specific embodiment of a HDI board manufacturing method in the present invention; comprising:

[0043] Core board processing step, drilling micro-holes on the core board, electroplating and filling blind holes, and pattern transfer;

[0044] The interconnection unit acquisition step is to brown the core board, paste the prepreg and the protective film, drill holes in the prepreg corresponding to the microholes of the core board, plug the prepreg with conductive paste, heat and cure the conductive paste, and remove the protection The core board behind the film is an interconnected unit; in this embodiment, the protective film is Mylar film;

[0045] In the pressing step, a plurality of interconnection units are obtained for one-time stacking and lamination, and any layer interconnection between the plurality of interconnection units is realized through conductive paste ...

Embodiment 2

[0081] A kind of HDI board, HDI board is made according to the manufacturing method of HDI board described in embodiment 1.

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Abstract

The invention discloses an HDI board fabrication method and an HDI board. The HDI board fabrication method comprises the steps of processing a core board by a core board processing step, performing browning, prepreg pasting and protection film on the processed core board, drilling a position corresponding to a micropore of the core board, filling the hole with conductive paste to obtain an interconnection unit, and finally, laminating a plurality of interconnection units in one time to achieve interconnection of an arbitrary layer so as to obtain the HDI board. Through hole filling by the conductive paste, the hole filling efficiency is high; moreover, the core board coated with the conductive paste and a prepreg is used as the interconnection unit, the plurality of interconnection units are laminated in one time to fabricate the HDI board, the board is not needed to fabricated by lamination layer by layer, the fabrication efficiency of the HDI board is effectively improved, and the technical problem that the a conventional lamination method for fabricating HDI board in the prior art is extremely long in process flow to cause extremely low fabrication efficiency of the HDI board issolved.

Description

technical field [0001] The invention relates to the technical field of PCB, in particular to a manufacturing method of an HDI board and an HDI board. Background technique [0002] HDI is the abbreviation of High Density Interconnector (High Density Interconnector), which is a kind of (technology) for producing printed circuit boards. [0003] With the development of science and technology, the production of circuit boards has been automated, which has greatly improved the production efficiency of circuit boards. However, for the production process of HDI boards, in the known technology, the conventional lamination process is used for production, and the process flow is extremely long, resulting in a very low production efficiency of HDI boards. Therefore, it is urgent to improve this problem. Contents of the invention [0004] The present invention aims to solve one of the technical problems in the related art at least to a certain extent. Therefore, an object of the pre...

Claims

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Application Information

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IPC IPC(8): H05K3/46H05K3/42H05K1/02H05K1/11
Inventor 陆天华孙文兵
Owner 深圳明阳电路科技股份有限公司
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