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Pulse electroplating method based on dual-phase pulse

A pulse electroplating and reverse pulse technology, applied in the field of electroplating of printed circuit boards and semiconductor interconnections, can solve the problems of increasing process steps, increasing material loss, product scrap rate, signal attenuation, etc., achieving high efficiency, material saving and high efficiency , to avoid the effect of bag hole

Pending Publication Date: 2020-05-05
广州精原科技有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, DC electroplating and 1:20 positive and negative pulses are commonly used to electroplate to realize HDI interconnection, but these two processes have the following problems: 1) For high aspect ratio via hole filling, whether it is conventional DC or 1:20 positive Negative pulse plating, there is a high risk of "holes", that is, the two ends of the through hole are closed, and there is a hole in the middle, and the signal will be seriously attenuated during the transmission process; 2) High-density, high-precision lines mean that the conductive The layer needs thin surface copper, but the PCB boards electroplated by these two processes often need further mechanical grinding or chemical copper reduction to thin the surface copper layer, which not only increases the tedious process steps, but also increases the material cost. Loss, finished product and product scrap rate

Method used

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Examples

Experimental program
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Effect test

Embodiment 1

[0074] Embodiment 1 of the present invention provides a pulse electroplating method based on biphasic pulses, which includes the following steps: placing a ceramic material workpiece with a through hole aspect ratio of 5:1 through a substrate containing 11g / L Cu 2+ , 145g / L triethanolamine, 6g / L NaOH, 4g / L KNO 3 In the alkaline electroless copper plating solution, after electroplating at a current density of 1.5ASD at 55°C for 30s, a pre-copper-plated workpiece is obtained; the pre-copper-plated workpiece is placed in an acidic copper electroplating solution, and the anode It is a phosphorus copper ball with a phosphorus content of 0.05wt%. After pulse electroplating for 180 minutes on the component surface and the welding surface of the workpiece at 24° C., the processed workpiece is obtained.

[0075] Described acid electroplating copper solution comprises: 200g / LCuSO 4 ·5H 2 O, 85g / LH 2 SO 4 , 75mg / L NaCl, 10mL / L polyethylene glycol, 4.5mL / L sodium dimethylformamide sul...

Embodiment 2

[0081] Embodiment 2 of the present invention provides a pulse electroplating method based on biphasic pulses, which includes the following steps: placing a ceramic material workpiece with a through hole aspect ratio of 3:1 through a substrate containing 11g / L Cu 2+ , 145g / L triethanolamine, 6g / L NaOH, 4g / L KNO 3 In the alkaline electroless copper plating solution, after electroplating at a current density of 1.5ASD at 55°C for 30s, a pre-copper-plated workpiece is obtained; the pre-copper-plated workpiece is placed in an acidic copper electroplating solution, and the anode It is a phosphor copper ball with a phosphorus content of 0.03 wt%, and pulse electroplating is performed on the component surface and the welding surface of the workpiece at 22° C. for 100 minutes to obtain the processed workpiece.

[0082] Described acid electroplating copper solution comprises: 180g / LCuSO 4 ·5H 2 O, 80g / LH 2 SO 4 , 60mg / L NaCl, 5.0mL / L polyethylene glycol, 1.0mL / L sodium dimethylforma...

Embodiment 3

[0088] Embodiment 3 of the present invention provides a pulse electroplating method based on biphasic pulses, which includes the following steps: placing a ceramic material workpiece with a through hole aspect ratio of 6:1 through a substrate containing 11g / L Cu 2+ , 145g / L triethanolamine, 6g / L NaOH, 4g / L KNO 3 In the alkaline electroless copper plating solution, after electroplating at a current density of 1.5ASD at 55°C for 30s, a pre-copper-plated workpiece is obtained; the pre-copper-plated workpiece is placed in an acidic copper electroplating solution, and the anode It is a phosphorus copper ball with a phosphorus content of 0.35wt%, and after performing pulse electroplating on the component surface and the welding surface of the workpiece for 250 minutes at 28° C., the processed workpiece is obtained.

[0089] Described acid electroplating copper solution comprises: 220g / LCuSO 4 ·5H 2 O, 110g / LH 2 SO 4 , 80mg / L NaCl, 30mL / L polyethylene glycol, 10mL / L sodium dimethyl...

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Abstract

The invention discloses a pulse electroplating method based on dual-phase pulse. The pulse electroplating method comprises the following steps of after pre-plating copper on a workpiece, putting the workpiece into an acidic copper electroplating solution; and carrying out pulse electroplating on an element surface and a welding surface of the workpiece to obtain the treated workpiece. The treatedworkpiece has the advantages of high through hole filling efficiency, strong reliability and thin surface copper; a hole covering phenomenon is avoided, and material saving and efficient production are realized; and the pulse electroplating method is especially suitable for carrying out pulse electroplating hole filling on through holes with various aspect ratios.

Description

technical field [0001] The invention relates to the technical field of electroplating of printed circuit boards and semiconductor interconnections, in particular to a pulse electroplating method based on biphasic pulses. Background technique [0002] With the development of electronic products in the direction of thinner and shorter, electronic chips are becoming smaller and more powerful; PCB boards as chip carriers also tend to be multi-layered, high-density, high-thickness ratio, and limited loading The surface area makes the traditional via interconnection unable to meet the requirements of high integration, high frequency, and high precision. HDI technology (High Density Interconnector, high-density interconnection technology) has gradually replaced the conventional resin plug hole and conductive paste filling process to obtain logic circuits with more layers and higher precision and packaging substrates. [0003] At present, DC electroplating and 1:20 positive and neg...

Claims

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Application Information

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IPC IPC(8): C25D5/18C25D3/38
CPCC25D3/38C25D5/18
Inventor 侯鸿斌施佳抄毕桃平邓志克张春晓
Owner 广州精原科技有限公司
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