Hole filling liquid medicine for direct current electroplating of micro blind hole

A DC electroplating and potion technology, applied in electrical components, printed circuits, printed circuit manufacturing, etc., can solve the problems of large production loss, difficult to handle small blind holes with apertures, and high cost of pulse electroplating, achieving low equipment requirements and improving packaging. Holes, the effect of easy infiltration and exchange

Active Publication Date: 2018-06-15
SHENZHEN BANMING SCI & TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] For this reason, the technical problem to be solved by the present invention is that it is difficult for traditional electroplating hole-filling solutions to deal with blind holes with small apertures and high thickness-to-diameter ratios, while pulse electroplating is costly and has large production losses. High-quality fine blind via direct current electroplating hole filling solution

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 2

[0023] This embodiment provides a kind of microblind hole DC electroplating potion filling, the potion includes a wetting agent, a high-efficiency inhibitor, an accelerator, a leveling agent and a solvent, wherein the solvent is water, and the wetting agent is Small molecule surfactant, in the present embodiment, described small molecule surfactant is diethylene glycol, and its concentration is 10ppm, and described small molecule surfactant is easy to degrease etc. wetting action to copper face and enter hole , which makes the exchange of the follow-up potion outside and inside the pores easier, and copper ions and necessary additive molecules can be quickly replenished. The high-efficiency inhibitor is a macromolecular inhibitor, and the macromolecular inhibitor is a branch formed by connecting a homopolymer or a copolymer of ethylene glycol or propylene glycol through a nitrogen atom (connected by a secondary amine, a tertiary amine or a quaternary amine bond). In the presen...

Embodiment 3

[0026] This embodiment provides a kind of microblind hole DC electroplating potion filling, the potion includes a wetting agent, a high-efficiency inhibitor, an accelerator, a leveling agent and a solvent, wherein the solvent is water, and the wetting agent is Small molecule surfactant, in the present embodiment, described small molecule surfactant is triethylene glycol, and its concentration is 10000ppm, and described small molecule surfactant is easy to carry out degreasing etc. in copper face and access hole The wetting effect makes the exchange of subsequent liquid medicine outside and inside the pores easier, and copper ions and necessary additive molecules can be quickly replenished. The high-efficiency inhibitor is a macromolecular inhibitor, and the macromolecular inhibitor is a branch formed by connecting a homopolymer or a copolymer of ethylene glycol or propylene glycol through a nitrogen atom (connected by a secondary amine, a tertiary amine or a quaternary amine bo...

Embodiment 4

[0029] This embodiment provides a kind of microblind hole DC electroplating potion filling, the potion includes a wetting agent, a high-efficiency inhibitor, an accelerator, a leveling agent and a solvent, wherein the solvent is water, and the wetting agent is Small molecule surfactant, in the present embodiment, described small molecule surfactant is tetraethylene glycol, and its concentration is 500ppm, and described small molecule surfactant is easy to carry out degreasing etc. in copper face and access hole The wetting effect makes the exchange of subsequent liquid medicine outside and inside the pores easier, and copper ions and necessary additive molecules can be quickly replenished. The high-efficiency inhibitor is a macromolecular inhibitor, and the macromolecular inhibitor is a branch formed by connecting a homopolymer or a copolymer of ethylene glycol or propylene glycol through a nitrogen atom (connected by a secondary amine, a tertiary amine or a quaternary amine bo...

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Abstract

The invention discloses a hole filling liquid medicine for direct current electroplating of a micro blind hole. The hole filling liquid medicine comprises a wetting agent, an efficient inhibitor, an accelerator and a leveling agent, wherein the wetting agent plays a role in increasing the wettability of a copper surface, so that holes in the hole are prevented from being generated due to the factthat copper ions in the hole are not consumed in time. According to the hole filling liquid medicine, the efficient inhibitor is effectively adsorbed in the vicinity of a hole opening, and copper growth of the hole opening is prevented, so that the hole wrapping phenomenon caused by too fast growth of the electroplating copper at the hole opening of the fine blind hole is improved; the acceleratorcan enter the hole and can be rapidly enriched with electroplating, so that the plating speed in the hole is higher than the plating speed of the exterior of the hole, and the effect of efficiently filling the hole is achieved; the leveling agent is combined with a part with dense negative charges at the hole opening, the copper plating speed of the hole openning is inhibited, and holes in the hole are prevented from being generated; by means of the synergistic effect of the components, efficient electroplating filling of fine and high-thickness-diameter-ratio blind holes is realized, the hole filling process can be completed through direct current plating, cost is low, the hole filling efficiency is high, the quality is high, and the equipment requirement is low, and the hole filling liquid medicine is suitable for a blind hole filling process with the processing aperture being lower than 60 microns and the thickness-diameter ratio being greater than 1.

Description

technical field [0001] The invention belongs to the technical field of printed circuit board production, and relates to an electroplating hole-filling solution, in particular to a direct-current electroplating and hole-filling solution for tiny blind holes. Background technique [0002] Printed circuit board (PCB), also known as printed circuit board, is one of the important components of the electronics industry. It is used to realize the electrical connection of electronic components and reduce wiring and matching errors. With the rapid development of the electronic information industry, electronic products With the continuous development of communication equipment in the direction of thinner, integrated and multi-functional, PCB manufacturers are forced to continuously innovate in technology and process, and promote the progress of printed circuit boards in the direction of higher wiring density, precision and reliability. More tiny devices can be loaded on the limited bo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/38H05K3/42
CPCH05K3/0088H05K3/423C25D3/38
Inventor 夏海郝意黄志齐丁杰王扩军
Owner SHENZHEN BANMING SCI & TECH CO LTD
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