Double-wave-crest welding device

Abstract

The invention discloses a double-wave-crest welding device. The double-wave-crest welding device comprises a shell. A tin liquid tank is arranged in the shell and internally and sequentially providedwith a flat wave generation device and a jet flow wave crest generation device in the PCB tin welding direction. The flat wave generation device is provided with a flat wave spraying port. The jet flow wave crest generation device is provided with a wave crest spraying port used for spraying out tin liquid so that a tin flow wave crest can be formed. The spraying-out direction of the wave crest spraying port is arranged towards the flat wave spraying port. After the formed tin flow wave crest makes contact with a PCB, the formed tin flow wave crest falls into the flat wave spraying port. The technical scheme is particularly suitable for the thick PCB, during welding, the contact width between the PCB and the wave surface is lengthened, the contact time between various element pins on the board and the tin liquid is prolonged, and since the tin flow flat wave heats the welding area of the PCB and welding flux is wetted sufficiently and evenly, the tin liquid can sufficiently enter various narrow and dense welding areas of components, and it is guaranteed that the tin liquid seeps into through holes where the pins are located. When the PCB and the tin flow wave crest are in contact,excessive welding flux at the welding point positions can be washed away, and accordingly the phenomenon of bridging is avoided.

Description

technical field [0001] The invention relates to the technical field of wave soldering, in particular to a double wave soldering device. Background technique [0002] At present, the existing wave soldering machine usually adopts the double wave soldering method. Two nozzles are set opposite to each other to form two mutually spaced tin flow peaks. The surface interferes with each other, so that the PCB board needs to go through a certain distance after passing the first wave peak to contact the second wave peak, resulting in a large drop in the temperature of the tin liquid attached to the solder joint after passing the first wave peak. It is easy to appear that the bridging tin slag cannot be washed away when passing through the second wave peak; and the contact area between the PCB board and the two wave peaks is small, when soldering a thicker PCB board, it is necessary to slow down the movement of the PCB board Speed, so as to ensure the contact time between the solder ...

AI Technical Summary

Problems solved by technology

[0002] At present, the existing wave soldering machine usually adopts the double wave soldering method. Two nozzles are set opposite to each other to form two mutually spaced tin flow peaks. The surface interferes with each other, so that the PCB board needs to go through a certain distance after passing the first wave peak to contact the second wave peak, resulting in a large drop in the temperature of the tin liquid attached to the solder joint after passing the first wave peak. It is easy to appear that the bridging tin slag cannot be washed away when passing through the second wave peak; and the contact area between the PCB board and the two wave peaks is small, when soldering a thicker PCB board, it is necessary to slow down the movement of the PCB board Speed, so as to ensure the contact time between the solder joints on the PCB and the peaks, to ensure that the tin liquid can completely penetrate into the through holes where the pins are located, so that the pins can be soldered to each layer of the circuit, but slow down the speed of the PCB It greatly affects the production speed of the soldering machine and increases the production cost

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