Multistage overlapped semiconductor ultralow-temperature rapid heating and cooling device

Abstract

The invention discloses a multistage overlapped semiconductor ultralow-temperature rapid heating and cooling device. The device structurally comprises a shell, an auxiliary temperature changing device, a movable door plate, a door plate handle and a semiconductor temperature changing generation cavity, wherein the shell is formed by combining the semiconductor temperature changing generation cavity and the auxiliary temperature changing device. The beneficial effects of the invention are as follows: a driving rod is mechanically connected with a driving bar on a recovery port communicating with a second cavity through a positioning movable plate, thus the driving rod is driven to move through the rotation of a rotating door plate communicating with a first cavity, and therefore, the recovery port communicating with the second cavity is controlled to rotate in the opposite direction, and control on a single variable is achieved; forward and reverse rotation of a gear is controlled through external force, lifting motion of the door plate is controlled, thus alternate unblocking and closing of a first input port and a second input port are achieved, and therefore required temperaturesupply is provided for a variable-temperature working cavity through alternate opening and closing of the first input port and the second input port, the purpose of accelerating to achieve temperaturechange is achieved, and the experiment requirement is met.

Description

technical field [0001] The invention relates to the field of semiconductors, in particular to a multi-level stacked semiconductor ultra-low temperature rapid heating and cooling device. Background technique [0002] In view of the exploration of cryopreservation, freeze-drying and resuscitation of complex life active substances in biotechnology, since the eutectic point of salt-containing substances is even below -40°C, a huge instantaneous cooling capacity is required to penetrate the eutectic range and The active ingredient is fragile, sensitive to the process temperature, and the temperature control process is difficult. In order to meet the needs of biotechnology exploration experiments, there is an urgent need for a refrigeration device that can quickly cool down to below -50°C and accurately control the heating and cooling rate. The current ultra-low temperature rapid heating and cooling device has the following defects: [0003] In order to meet the needs of biologic...

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Problems solved by technology

[0003] In order to meet the needs of biological experiments, semiconductor refrigeration chips are used to achieve cooling, and at the same time, the technology of semiconductor refrigeration sheet overlay is used to achieve ultra-low temperatures below -50°C. The temperature is raised or lowered in the working chamber, and the original temperature is not stored and kept at a constant temperature while changing the temperature of the working chamber, which prolongs the time for changing the temperature and causes waste

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