Multi-level stacked semiconductor ultra-low temperature rapid heating and cooling device

Abstract

The invention discloses a multi-stage stacked semiconductor ultra-low temperature rapid temperature rise and fall device. The structure includes a casing, an auxiliary temperature changing device, a movable door panel, a door handle, and a semiconductor temperature variable generating chamber. The casing is composed of a semiconductor temperature variable generating chamber and an auxiliary temperature variable device. The present invention Beneficial effect: use the mechanical connection between the drive rod and the drive rod on the recovery port connected to the second cavity through the positioning movable plate, and realize the rotation of the revolving door plate connected to the first cavity to drive the drive rod to move, thereby controlling the connection with the second cavity The connected recovery port rotates in the opposite direction to realize the control of a single variable. The positive and negative rotation of the gear is controlled by an external force, and the lifting movement of the door panel is controlled to realize the alternate unblocking and closing of the No. 1 input port and the No. 2 input port. The alternate switch between the No. 1 input port and the No. 2 input port provides the required temperature supply to the variable temperature working chamber, so as to achieve the purpose of accelerating the temperature change and meet the needs of the experiment.

Description

technical field [0001] The invention relates to the field of semiconductors, in particular to a multi-level stacked semiconductor ultra-low temperature rapid heating and cooling device. Background technique [0002] In view of the exploration of cryopreservation, freeze-drying and resuscitation of complex life active substances in biotechnology, since the eutectic point of salt-containing substances is even below -40°C, a huge instantaneous cooling capacity is required to penetrate the eutectic range and The active ingredient is fragile, sensitive to the process temperature, and the temperature control process is difficult. In order to meet the needs of biotechnology exploration experiments, there is an urgent need for a refrigeration device that can quickly cool down to below -50°C and accurately control the heating and cooling rate. The current ultra-low temperature rapid heating and cooling device has the following defects: [0003] In order to meet the needs of biologic...

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Problems solved by technology

[0003] In order to meet the needs of biological experiments, semiconductor refrigeration chips are used to achieve cooling, and at the same time, the technology of semiconductor refrigeration sheet overlay is used to achieve ultra-low temperatures below -50°C. The temperature is raised or lowered in the working chamber, and the original temperature is not stored and kept at a constant temperature while changing the temperature of the working chamber, which prolongs the time for changing the temperature and causes waste

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