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Preparation method of light-emitting diode chip and light-emitting diode chip

A technology of light-emitting diodes and chips, which is applied to electrical components, circuits, semiconductor devices, etc., can solve the problems of low luminous efficiency of light-emitting diode chips

Active Publication Date: 2019-07-12
ELEC TECH PHOTOELECTRIC TECH DALIAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Based on this, it is necessary to provide a method for preparing a light emitting diode chip and an

Method used

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  • Preparation method of light-emitting diode chip and light-emitting diode chip
  • Preparation method of light-emitting diode chip and light-emitting diode chip
  • Preparation method of light-emitting diode chip and light-emitting diode chip

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Embodiment Construction

[0041] In order to make the purpose, technical solutions, and advantages of the application more clear, the application will be further described in detail below with reference to embodiments and drawings. It should be understood that the specific embodiments described here are only used to explain the application, and not used to limit the application.

[0042] The serial numbers assigned to the parts herein, such as "first", "second", etc., are only used to distinguish the described objects and do not have any sequence or technical meaning. The terms "connection" and "connection" in this application, unless otherwise specified, include direct and indirect connection (connection). In the description of this application, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", The orientation or positional relationship indicated by "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. is based on the ...

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Abstract

The invention provides a preparation method of a light-emitting diode chip and the light-emitting diode chip. When a side wall is provided with a plurality of inclined surfaces, the area of the side wall is larger, and the more light is emitted from the side wall. When the side wall is provided with the plurality of inclined surfaces, the more internal light is incident to the inclined angle on the side wall, and the light extraction is increased, so that the brightness of the light-emitting diode chip is improved. The plurality of the inclined surfaces form the side walls with different shapes, so that internal light can be incident to the side wall to generate different inclined angles, more light can be taken out, and more total reflection can be avoided. The angle between the adjacentinclined surfaces of the side wall of the isolation groove by employing the preparation method of the light-emitting diode chip is a positive angle, and when an insulating layer manufactured subsequently can cover the isolation groove for better insulation.

Description

Technical field [0001] This application relates to the technical field of semiconductor devices, in particular to a method for preparing a light emitting diode chip and a light emitting diode chip. Background technique [0002] Light-Emitting Diode (LED) is a semiconductor light-emitting device made by the principle of semiconductor P-N junction electroluminescence. LED has the advantages of pollution-free, high brightness, low power consumption, long life, low working voltage, and easy miniaturization. With the continuous development of research, the application fields are becoming wider and wider. At the same time, in order to avoid the occurrence of side wall leakage, the manufacturing process of the isolation groove method is adopted, and the insulating layer is deposited after the side wall isolation groove is etched to avoid failures such as side wall leakage. Therefore, the topography of the sidewall of the isolation trench has an important influence on the photoelectric ...

Claims

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Application Information

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IPC IPC(8): H01L33/00H01L33/20
CPCH01L33/005H01L33/20
Inventor 王思博简弘安刘宇轩
Owner ELEC TECH PHOTOELECTRIC TECH DALIAN