Heat isolation organ protection cover

A protective cover and organ technology, applied in the direction of additive processing, etc., to achieve the effect of reducing thermal conductivity

Pending Publication Date: 2019-07-16
严铜
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to overcome the deficiencies of the prior art, the present invention provides a heat-insulating organ protective c

Method used

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Examples

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Embodiment 1

[0023] Such as figure 1 with figure 2 As shown, in this embodiment, the protective cover of the heat-insulating organ comprises three layers of wave-shaped heat-insulating layers, which are respectively the first heat-insulating layer 11 , the second heat-insulating layer 12 and the third heat-insulating layer 13 . Such as image 3 As shown, the first heat insulation layer 11 is stitched and connected at the first seam point 101 and the fifth seam point 105 using high-temperature thread to form a wave-shaped structure, the first seam point 101 is its crest, and the fifth seam point 105 is its crest. at the trough. Similarly, the second heat insulation layer 12 is stitched and connected at the second seam point 102 and the third seam point 103 to form a wave-shaped structure of the second heat insulation layer; the third heat insulation layer 13 is connected at the fourth seam point 104 and the The six seaming points 106 are seamed and connected to form the wavy structure o...

Embodiment 2

[0029] Such as Figure 5 with Image 6 As shown, in this embodiment, the heat-insulating organ protective cover includes four layers of corrugated heat-insulating layers, which are respectively the first heat-insulating layer 21, the second heat-insulating layer 22, the third heat-insulating layer 23 and the fourth heat-insulating layer twenty four. Such as Figure 7 As shown, the first heat insulation layer 21 is stitched and connected at the first seam point 201 and the seventh seam point 207 using high-temperature thread to form a wave-shaped structure, the first seam point 201 is its crest, and the seventh seam point 207 is its peak. at the trough. Similarly, the second heat insulation layer 22 is seamed and connected at the second seam point 202 and the third seam point 203, the third heat insulation layer 23 is seamed and connected at the fourth seam point 204 and the fifth seam point 205, and the fourth heat insulation layer The thermal layer 24 is stitched and conn...

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Abstract

The invention discloses a heat isolation organ protection cover for a 3D printer. The problem about heat isolation protection between a current 3D printer high-temperature cavity and a motion component is solved. A plurality of waveform heat isolation layers are included. Each heat isolation layer is connected with the adjacent heat isolation layer at the position of the wave crest or the trough.After the organ protection cover is stretched, a hollow structure is formed between every two adjacent heat isolation layers. Through the hollow structures between the heat isolation layers and isolation of the multiple heat isolation layers, the heat conductivity between an upper face and a lower face of the organ protection cover is greatly reduced, good heat isolation and heat preservation performance of the heat isolation organ protection cover is achieved, and accordingly the problem about heat isolation protection between the 3D printer high-temperature cavity and the motion component issolved.

Description

technical field [0001] The invention belongs to the technical field of 3D printers, and in particular relates to a heat-insulating organ protective cover for 3D printers. Background technique [0002] 3D printing technology is a rapid prototyping technology. It is based on digital three-dimensional model files, and it is a technology that forms objects such as metal, plastic, and photosensitive resin through layer-by-layer printing. It belongs to additive manufacturing. Compared with traditional processing methods, it has fast forming speed, no need for molds, and can form complex structures that cannot be realized by traditional methods. At present, this method has been widely used in many fields such as education, jewelry, medical treatment, and industrial design. [0003] Many printing materials, especially crystalline polymers, need to be molded well at a high, uniform and stable specific cavity temperature. For example, when special engineering plastics such as PEI and...

Claims

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Application Information

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IPC IPC(8): B29C64/20B33Y30/00
CPCB33Y30/00
Inventor 严铜
Owner 严铜
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