High-color-rendering remote fluorescent LED device and preparation method thereof

Abstract

The invention provides a high-color-rendering remote fluorescent LED device and a preparation method thereof; according to the device, a single or array-type distribution blue-light LED chip is fixedin a functional area of an LED packaging substrate, and the chip is electrically connected with a substrate electrode; meanwhile, a heat conduction column is assembled in an interval region of the chip, and the heat conduction column is higher than the chip; then a red fluorescent powder layer is coated on the functional area and the surface of the LED chip; and finally a blocky solid fluorescentbody covers the upward side of the functional area of the packaging substrate and is very close to or in contact with the heat conduction column. The high color rendering property of the LED device can be realized through the red fluorescent powder and the blocky solid fluorescent body; and meanwhile, the two kinds of fluorescent materials are separated, so that heat dissipation of different channels of the fluorescent materials is realized, thereby improving the heat dissipation capability of the LED device.

Description

technical field [0001] The disclosure belongs to the technical field of LED devices, in particular to a remote fluorescent LED device with high color rendering and a preparation method thereof. Background technique [0002] With the advancement of technology and the expansion of application fields, people pay more and more attention to high-power LED light sources. The traditional LED light source is generally packaged with phosphor powder mixed with organic colloid. This packaging method makes the phosphor powder dispersed in transparent silica gel or epoxy resin glue. When the power is low, this packaging form is effective and feasible, but as the power density of the LED device increases, especially when the integrated packaging method is used, the two high-power heat sources, the chip and the fluorescent material, will overlap each other, which will cause As a result, the junction temperature of the LED chip rises rapidly, and the phosphor will decay and age, and the or...

AI Technical Summary

Problems solved by technology

When the power is low, this packaging form is effective and feasible, but as the power density of the LED device increases, especially when the integrated packaging method is used, the two high-power heat sources, the chip and the fluorescent material, will overlap each other, which will cause As a result, the junction temperature of the LED chip rises rapidly, and the phosphor will decay and age, and the organic colloid will even be carbonized, which will lead to a decrease in the luminous efficiency of the light source and a shortened lifespan.

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