A kind of semiconductor laser and laser chip

Abstract

The invention discloses a semiconductor laser and a laser chip. According to the temperature distribution on the resonant cavity of the laser chip, the semiconductor laser adjusts the width of the transitional heat sink so that On the other hand, the temperature is uniformly distributed; and the laser chip adjusts the width of each ridge waveguide structure and the distance between each ridge waveguide structure according to the temperature distribution of the positions of the multiple ridge waveguide structures, so as to reduce the gap between the ridge waveguide structures. Influenced by the thermal crosstalk phenomenon among them, the temperature between each ridge waveguide structure is kept similar, thereby improving the stability of the semiconductor laser and the laser chip, and prolonging the service life of the semiconductor laser and the laser chip.

Description

technical field [0001] The invention relates to the technical field of lasers, in particular to a semiconductor laser and a laser chip. Background technique [0002] Since TO packaging technology is used to package lasers, it has the advantages of small parasitic parameters, simple process, low cost and convenient use, so TO packaging technology has been widely used in the field of laser packaging. However, lasers packaged in TO often have the following problems: Compared with the front cavity surface of the laser resonator, the rear cavity surface of the laser resonator is closer to the heat dissipation surface of the laser, which leads to the front cavity of the laser along the direction of the resonator The phenomenon that the temperature of the cavity surface is high and the temperature of the cavity surface is low, this uneven temperature distribution will affect the stability of the laser. [0003] In order to increase the output power of the laser, a multi-ridge semi...

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Problems solved by technology

However, lasers packaged in TO often have the following problems: Compared with the front cavity surface of the laser resonator, the rear cavity surface of the laser resonator is closer to the heat dissipation surface of the laser, which leads to the front cavity of the laser along the direction of the resonator The phenomenon that the temperature of the cavity surface is high and the temperature of the cavity surface is low, this uneven temperature distribution will affect the stability of the laser

[0003] In order to increase the output power of the laser, a multi-ridge semiconductor laser is often formed by setting a plurality of ridge waveguide structures arranged in an array, but this multi-ridge semiconductor laser will cause thermal crosstalk between each ridge waveguide structure. , causing the temperature of the laser chip to show that the center of the chip has a high temperature, while the edge of the chip has a low temperature, which seriously affects the output wavelength of the laser, affects the stability of the laser, and reduces its service life.

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