Protective method and device for liquid-cooled liquid leakage of communication equipment

Abstract

The invention discloses a protective method and device for liquid-cooled liquid leakage of communication equipment. The protective method for the liquid-cooled liquid leakage of the communication equipment comprises the following steps: a liquid-cooled backboard and a power and signal backboard are arranged for each layer of single board installed in each machine frame in a machine cabinet, and the liquid-cooled backboards and the power and signal backboards are isolated by regions; a liquid bearing groove used for receiving leaked liquid is formed below a liquid-cooled connecting interface between each layer of single board and each liquid-cooled backboard, and a liquid leakage state in each liquid bearing groove is monitored; and graded turn-off treatment is carried out on the machine cabinet and the machine frames after the monitored liquid leakage states are judged. The possibility of causing signal short circuit and power short circuit by liquid leakage is reduced; and the influence range of local liquid leakage faults is narrowed.

Description

technical field [0001] The invention relates to the technical field for solving liquid cooling leakage of communication equipment, in particular to a method and device for protecting liquid cooling leakage of communication equipment. Background technique [0002] Traditional communication equipment dissipates heat through forced air cooling, and there are multiple fans in the chassis. Air cooling has the following problems: high energy consumption, accounting for more than 10% of the effective power, which does not meet the requirements of green energy saving; the noise of the fan is also the main source of communication equipment noise, and in most cases it is the only source. With the development of technology and the development of the market, the power consumption of devices is increasing, and the power density is continuously increasing. For high-power devices such as processors and switching chips, according to the technology development roadmap, after 2 years, air-coo...

AI Technical Summary

Problems solved by technology

Air cooling has the following problems: high energy consumption, which generally accounts for more than 10% of the effective power, which does not meet the requirements of green energy saving; the noise of the fan is also the main source of the noise of communication equipment, and in most cases it is the only source

[0013] 1. Since the power supply, signal and liquid-cooled quick connectors are all located on the same side of the backplane and distributed vertically, when liquid leakage occurs at the liquid-cooled quick connector, the liquid will drip to the bottom of the backplane during the process of dripping downward. Power supply, signal circuit components, connectors, and PCB are likely to cause signal short circuit and power short circuit

[0014] Even if only one layer of boards is arranged in the same chassis, this layer corresponds to a backplane, and the liquid cooling quick connector is placed at the bottom of the backplane, the liquid will not drip to the power supply and Signal connectors, but because the liquid-cooled quick connector and the single-board electrical connector are located on the same side of the backplane, and the backplane cannot be partially sealed, the liquid will still splash on the single board, power supply, and electrical connectors when it drops

[0015] Therefore, there is a security risk

On the one hand, the business is damaged (in the field of telecommunications, reliability requirements are very high); on the other hand, if the power supply is short-circuited, it may catch fire and cause a safety accident, which is a more serious consequence

Therefore, to a certain extent, the risk and consequences of failure caused by liquid leakage are the reasons why liquid cooling cannot be popularized in telecommunications equipment at present.

[0016] 2. If figure 1 As shown, even if the liquid-cooled quick connector is placed at the bottom of the backplane corresponding to each board, in a chassis, there is no space between the multi-layer boards to place the water pan and detection sensor, so it is impossible to The first layer of veneer conducts flow diversion, and the liquid-cooled quick connector leaks will also drip onto the electrical connector of the lower veneer

[0017] 3. Only one water tray can be placed in one chassis, and the liquid leakage detection depends on the additional equipment of the external cabinet

Local faults have a large impact range

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