Method and apparatus for processing a workpiece

A technology for workpieces and processing methods, which is applied in the direction of the device for coating liquid on the surface, the spraying device with movable outlets, the spraying device, etc., which can solve the problem of increasing the number of grinding processes and achieve the number of grinding processes. Increase, efficient processing, and the effect of improving processing efficiency

Pending Publication Date: 2019-07-19
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, after carrying out the above steps and grinding the resin coated on the front surface of the workpiece, it is necessary to implement the process of grinding the back surface of the workpiece by another grinding device, so there are a number of grinding steps. Additional topics

Method used

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  • Method and apparatus for processing a workpiece
  • Method and apparatus for processing a workpiece
  • Method and apparatus for processing a workpiece

Examples

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Embodiment Construction

[0029] 1 processing device

[0030] figure 1 The shown processing device 1 is an example of a grinding device used for grinding a workpiece W. As shown in FIG. The workpiece W is an example of a circular plate-shaped workpiece, and a plurality of planned dividing lines S are formed in a grid pattern on the front Wa, and a plurality of division lines S are formed in each of the plurality of regions divided by the plurality of planned dividing lines S. Device D. The back surface Wb on the side opposite to the front surface Wa of the workpiece W is a surface to be processed which is subjected to grinding. The workpiece W described in this embodiment is formed of, for example, a silicon wafer.

[0031] The processing device 1 has a device base 2 extending in the Y-axis direction, and a box 4a for storing the workpiece W before grinding and a box 4a for storing the workpiece W after grinding are arranged on the front side of the device base 2 in the Y-axis direction. Cassette 4...

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Abstract

The invention provides a processing method and a processing apparatus for a processed workpiece. The processed workpiece can be processed efficiently without increasing the number of grinding processes. The workpiece processing method includes a resin coating step of coating a resin 100 on a front surface Wa of a workpiece W, a resin curing step of applying an ultraviolet ray to the coated resin 100 to be cured, a resin grinding step of grinding the cured resin 100a to be flattened with grinding stones 46, and a workpiece grinding step of holding the flattened resin 100a side of the workpieceW on a chuck table 8 and grinding the back surface Wb of the workpiece W with grinding stones 46. In the resin grinding step, grinding is performed while cleaning the resin 100a stuck to the grindingstones 46. Accordingly, it is possible to grind the resin 100a coated on the front surface Wa of the workpiece W and the back surface Wb of the workpiece W in the same apparatus.

Description

technical field [0001] The present invention relates to a processing method and a processing device for processing a workpiece. Background technique [0002] In the manufacturing process of semiconductor devices, streets are formed in a grid pattern on the front surface of a workpiece, and devices such as ICs and LSIs are formed in regions divided by the streets. After the back surface of the workpiece is ground and thinned to a predetermined thickness, it is divided along the lanes by a cutting device or the like to manufacture individual semiconductor device chips. When the workpiece is ground and thinned, resin is coated on the front surface of the workpiece in order to protect the device. In order to improve the thickness accuracy of the coated resin, a step of grinding and flattening the resin coated on the front surface of the workpiece is performed (see, for example, Patent Document 1 below). [0003] Patent Document 1: Japanese Patent Laid-Open No. 2009-43931 [0...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/3105H01L21/02B24B7/10B24B41/00B24B49/02B24B53/007
CPCH01L21/31058H01L21/02065B24B7/10B24B41/005B24B53/007B24B49/02B24B53/017H01L21/6715H01L21/78H01L21/304H01L21/76H01L21/02013H01L21/02052H01L22/12H01L21/67092H01L21/67051H01L21/67242B05C11/1005B05C9/12B24B37/00B24B49/04B24B37/34H01L21/67253B24B49/12B24B37/345B24B37/08B24B49/03B24B55/02B24B7/228B05B3/00
Inventor 渡边真也山端一郎铃木克彦
Owner DISCO CORP
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