Double-sided photoetching workpiece table based on double-mask alignment

Abstract

The invention discloses a double-sided photoetching workpiece table based on double-mask alignment. The double-sided photoetching workpiece table comprises a base, a lower mask leveling mechanism andan upper mask lifting mechanism, the base is the installation reference of the whole workpiece table and is composed of a bottom board and a guide rail installation base; the lower mask leveling mechanism is connected with the bottom board, leveling of an upper mask and a lower mask in the descending process is achieved through a hemisphere, a ball bowl and a spring mechanism, and locking of the leveling mechanism is achieved through the air cylinder locking and ball bowl vacuum adsorption mechanism; the upper mask lifting mechanism is driven by a motor driving a precision ball screw, and a rolling guide rail is used as a guide, to realize the ascending motion of the upper mask during piece placement and the descending motion during alignment exposure. By matching with a video alignment system and an illumination system, the device can be used for double-sided one-time exposure and double-sided simultaneous alignment, and has the advantages of high production efficiency, convenience inoperation and high exposure resolution.

Description

technical field [0001] The invention relates to the technical field of special equipment for microelectronics, in particular to a double-sided lithography workpiece table based on double-mask alignment, which can realize double-sided one-time exposure and double-sided simultaneous overlay for substrates with corresponding position requirements on the front and back sides . Background technique [0002] The double-sided lithography machine is a device that produces graphics with corresponding position requirements on the front and back of the substrate. The design of the existing double-sided lithography workpiece table is mainly based on the principle of bottom alignment. It places the left and right objective lenses of the microscope on the bottom of the workpiece table to align the left and right objective lenses of the microscope, collects the marks on the mask and images them on the display, and then puts them into the substrate. Facing down, adjust the substrate so tha...

AI Technical Summary

Problems solved by technology

At present, the double-sided lithography machine based on double-mask alignment on the market can only realize one-time exposure on both sides, that is, a pattern with corresponding position requirements can be produced on the front and back sides of the substrate at a single time, and it is impossible to perform multiple double-sided simultaneous overlays. There are certain limitations for production

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