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Method for manufacturing carrier and method for polishing dual surfaces of wafer

A manufacturing method and double-sided grinding technology, used in semiconductor/solid-state device manufacturing, grinding machine tools, manufacturing tools, etc., can solve problems such as low flatness quality, improve flatness quality, reduce residual distortion, and restrain grinding amount. effect of difference

Active Publication Date: 2019-07-26
SHIN-ETSU HANDOTAI CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] However, the double-sided polishing using the carrier for the known double-sided polishing apparatus has the problem that the difference in the polishing amount of the wafer is large, and the flatness quality is lowered.

Method used

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  • Method for manufacturing carrier and method for polishing dual surfaces of wafer
  • Method for manufacturing carrier and method for polishing dual surfaces of wafer
  • Method for manufacturing carrier and method for polishing dual surfaces of wafer

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Experimental program
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Embodiment Construction

[0044] As mentioned above, in order to improve the flatness of the wafer, it is also desirable that the warpage of the carrier is small. The warpage of the carrier is large due to the warpage generated from the laser processing of the carrier raw material plate to the cutting of the carrier shape. In the past, after processing, heat treatment and polishing were used to remove processing residual distortion to improve it. However, according to the study of the inventors of the present application, it has been found that the known amount of lapping (for example, 80 μm) is not a sufficient amount of lapping that can remove the residual processing distortion. The warpage of the carrier can be reduced by removing the residual processing distortion as much as possible, and in order to reduce the residual processing distortion, the residual distortion can be removed by increasing the processing amount of lapping.

[0045] In order to solve the known problems as described above, the i...

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Abstract

The invention relates to a manufacturing method of a carrier. Manufacturing carrier, support hole is formed in carrier, a method for manufacturing a carrier, which is disposed between an upper fixed disk and a lower fixed disk to which a polishing cloth is attached in a double-sided polishing machine for polishing both surfaces of a wafer, and which supports the wafer sandwiched between the upperfixed disk and the lower fixed disk during polishing, includes: a step for preparing a raw material sheet material that is a material for manufacturing the carrier; forming a supporting hole in the raw material plate; and a step for polishing the raw material plate having the support hole formed therein at a polishing amount of 250 mum or more, the method for manufacturing a carrier being capableof manufacturing a carrier for a double-sided polishing device having little warpage.

Description

technical field [0001] The present invention relates to a method for manufacturing a carrier for a double-sided polishing device that simultaneously polishes both sides of a wafer, and a method for polishing both sides of a wafer using the carrier. Background technique [0002] Wafer polishing of semiconductor wafers and the like includes methods of double-side polishing and single-side polishing. Among them, the device for double-sided grinding has a structure in which a polishing cloth (also known as a grinding pad) is attached to the upper fixed plate and the lower fixed plate, and a carrier (also known as a processing carrier) is placed therebetween (for example, the patent Document 1, Patent Document 2). In the double-side polishing, a wafer is further prepared in a wafer-supporting hole (hole) formed in a carrier, and a polishing slurry is dripped from an upper platen to perform polishing. Here, the double-sided polishing of the wafer is performed by rotating the car...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/08B24B37/28
CPCB24B37/08B24B37/28B23P9/025H01L21/304H01L21/30625
Inventor 上野淳一北爪大地
Owner SHIN-ETSU HANDOTAI CO LTD