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Method and device for processing a surface of a substrate by means of a particle beam

A particle beam and substrate technology, which is applied in the field of particle beam processing of the surface of substrates, can solve problems such as the reduction of ion beam processing accuracy

Inactive Publication Date: 2019-07-30
SCIA SYST GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

This makes ion beam processing less precise

Method used

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  • Method and device for processing a surface of a substrate by means of a particle beam
  • Method and device for processing a surface of a substrate by means of a particle beam
  • Method and device for processing a surface of a substrate by means of a particle beam

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Embodiment Construction

[0056] In the following detailed description, reference is made to the accompanying drawings, which form a part hereof, and in which are shown by way of illustrations specific embodiments in which the invention may be practiced. In this regard, directional terms such as "top", "bottom", "front", "rear", "front", "rear", etc. are used to indicate the orientation of the figures being described. Because components of an embodiment may be oriented in many different orientations, the directional terms are illustrative and in no way limiting. It is to be understood that other embodiments may be utilized and structural or logical changes may be made without departing from the scope of the present invention. It should be understood that the features of the various exemplary embodiments described herein can be combined with each other unless specifically stated otherwise. Accordingly, the following detailed description should not be taken in a limiting sense, and the scope of the inve...

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Abstract

The invention relates to a method and to a device for processing a surface of a substrate by means of a particle beam. The method comprises an irradiating of the surface (302) of the substrate (114),wherein in a first region (308) of the surface (302) of the substrate (114), the surface (302) of the substrate (114) is processed by means of the particle beam (104), which strikes the surface (302)of the substrate (114) unpulsed (306). In a second region (310) of the surface (302) of the substrate (114), the surface (302) of the substrate (114) is processed by means of the particle beam (104),which strikes the surface (302) of the substrate (114) pulsed (304).

Description

technical field [0001] The invention relates to a method and a device for treating the surface of a substrate by means of a particle beam. Background technique [0002] In industry, for example, when the surface of the component has unevenness, and there is a deviation between the surface and the target shape (target) (i.e. target plane), such as with too much or too little material, the application of coated semiconductor Or other surface treatment methods for component surfaces. . [0003] For example, excess material can be removed by means of ion beam etching. In the case of site-selective ion beam etching, the ion beam is moved relative to the surface to be treated. The surface to be treated can be divided into several surface sections. During scanning, the ion beam dwells in the respective surface sections correspondingly for a predetermined time. [0004] Figure 4 Shown is a schematic cross-sectional view of a substrate 400 having a surface 406 to be processed t...

Claims

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Application Information

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IPC IPC(8): H01J37/305C23C14/34C23C14/35H01J37/304H01L21/306
CPCC23C14/48H01J37/304H01J37/3053H01J37/3056H01J37/3405H01J37/3467H01J2237/08H01J2237/30455H01J2237/30466H01J2237/30483H01J2237/3151H01J2237/3174H01L21/3065C23C14/221
Inventor T·顿格M·德姆勒C·舒尔茨T·托纳特M·泽纳M·内斯特勒
Owner SCIA SYST GMBH
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