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Device and method for manufacturing heterogeneous metal multilayer composite board

A technology of heterogeneous metals and preparation devices, which is applied in lamination devices, chemical instruments and methods, lamination and other directions, can solve the problems of layered composite of difficult heterogeneous metals, and achieve the effect of improving quality and preventing high temperature oxidation.

Active Publication Date: 2020-11-03
JILIN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The purpose of the present invention is to propose a preparation device for heterogeneous metal multilayer composite boards in view of the difficult problem that the existing preparation methods are difficult to realize the layered composite of heterogeneous metals

Method used

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  • Device and method for manufacturing heterogeneous metal multilayer composite board
  • Device and method for manufacturing heterogeneous metal multilayer composite board
  • Device and method for manufacturing heterogeneous metal multilayer composite board

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Embodiment Construction

[0033] The specific embodiment is described in conjunction with the accompanying drawings. The metal ingot 4 chooses a magnesium alloy ingot as a raw material, the grade is AZ91, the grade of the stainless steel plate is 022Cr19Ni10, the thickness of the stainless steel plate is 0.3mm, and the gap between the stainless steel plates is 0.5mm.

[0034]The heterogeneous metal multi-layer composite board preparation device consists of upper template 2, extrusion column 3, magnesium alloy ingot 4, guide column 5, compression spring 6, upper cover plate 7, heat insulation layer 8, extrusion cylinder 9, flow guide Slot plate 10, guide orifice plate 11, intake pipe 12, intake valve 13, lower template 14, top block 15, top column 16, baffle plate 18, exhaust pipe 19, exhaust valve 20, heating body 21, heating Coil 22, stainless steel plate right support 24, stainless steel plate left support 25 form.

[0035] The lower part of the upper formwork 2 is fixedly connected with the extrusio...

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Abstract

The invention discloses a preparation device and method for a heterogeneous metal multilayer composite board, and belongs to the field of processing of metal composite boards. The interface bonding performance is crucial to forming of heterogeneous metal composite boards with larger difference of melting points and mechanical properties, an ideal bonding surface is difficult to obtain due to the fact that the problems of uncoordinated deformation, oxidization and the like exist in traditional rolling bonding, and all the more so for forming of the multilayer alternately stacked heterogeneous composite boards. Therefore, according to the preparation device and method, a stainless steel plate assembly is placed in tooth grooves in the side surfaces of a left support and a right support firstly; an upper cover assembly moves downwards to form closed space with a lower die assembly; the device is powered on and heated, ingot metal is heated to be molten under nitrogen protection, an extrusion column moves downwards to extrude a metal melt, and the metal melt passes through guiding grooves formed in a guiding groove board and a guiding hole board and fills gaps among stainless steel plates spaced at intervals.

Description

technical field [0001] The invention belongs to the field of processing metal composite boards, and in particular relates to a preparation device for heterogeneous metal multilayer composite boards. Background technique [0002] With the rapid development of science and technology, higher requirements are put forward for the comprehensive performance of materials, and a single metal material cannot meet the increasingly complex use requirements. The layered metal composite plate based on bionic design can take advantage of the respective advantages of the component materials, so as to make up for the shortcomings of each component, and has excellent comprehensive properties that cannot be compared with a single metal or alloy, and has become a research hotspot in material science today. Each layer of metal in the layered metal composite board still maintains its original characteristics, but its overall physical, chemical and mechanical properties have been greatly improved ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B37/10B32B37/06B32B38/00B32B38/16
CPCB32B37/06B32B37/10B32B38/0036B32B38/162
Inventor 宋家旺王慧远查敏管志平马品奎李志刚王明辉任明文韩洪江赵泼高丹周晓丽
Owner JILIN UNIV