Array substrate and its preparation method
An array substrate and substrate technology, applied in the field of array substrate and its preparation, can solve the problems of poor display performance of display devices
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0029] like figure 1 , Figures 2a to 2d As shown, this embodiment provides an array substrate, including:
[0030] base 10;
[0031] The first transistor 20 disposed on the substrate 10 includes a first active layer 21 formed of a low-temperature polysilicon material;
[0032] The second transistor 30 disposed on the side of the first transistor 20 away from the substrate 10 includes a second active layer 31 formed of a metal oxide semiconductor material;
[0033] The barrier layer 40 is located between the first transistor 20 and the second transistor 30 , and the barrier layer 40 is used to prevent the hydrogen element in the first active layer 21 from diffusing into the second active layer 31 .
[0034] Wherein, that is to say, the array substrate of this embodiment has at least two types of transistors: low-temperature polysilicon transistors and metal oxide transistors, that is, the first transistor 20 is a low-temperature polysilicon transistor with a first active la...
Embodiment 2
[0051] like figure 1 , Figures 2a to 2d As shown, this embodiment provides a method for preparing an array substrate, which is the method for preparing a display substrate in Embodiment 1, including:
[0052] S11 , forming a first transistor 20 on the substrate 10 .
[0053] Specifically, S111, such as Figure 2a As shown, a first active layer 21 of low temperature polysilicon, a first gate insulating layer, a first gate layer 24 , and a third conductive layer 53 disposed on the same layer as the first gate layer 24 are formed on the substrate 10 .
[0054] Wherein, the first active layer 21 is formed by laser rapid annealing process, and the first gate insulating layer and the first gate layer 24 are simultaneously formed by self-alignment process.
[0055] S112, such as Figure 2b As shown, an interlayer dielectric layer 64 (ILD) is formed on the first active layer 21, the first gate insulating layer, the first gate layer 24, and the third conductive layer 53 to form th...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More - R&D
- Intellectual Property
- Life Sciences
- Materials
- Tech Scout
- Unparalleled Data Quality
- Higher Quality Content
- 60% Fewer Hallucinations
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com



