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PCB thick copper plate segmented etching method

A thick copper plate and etching technology, applied in chemical/electrolytic methods to remove conductive materials, form electrical connection of printed components, and electrical components, etc., can solve problems such as copper burrs on lines, widen the scope, and solve residual copper on lines. burr effect

Inactive Publication Date: 2019-08-02
深圳市众阳电路科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the embodiments of the present invention is to provide a segmented etching method for PCB thick copper plates, so as to solve the problem of residual copper burrs on circuits after etching

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  • PCB thick copper plate segmented etching method
  • PCB thick copper plate segmented etching method
  • PCB thick copper plate segmented etching method

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Embodiment Construction

[0023] It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The present invention will be further described in detail below in conjunction with the drawings and specific embodiments.

[0024] If there are directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention, they are only used to explain the relative positions of the components in a certain posture (as shown in the drawings) relationship, motion, etc., if the particular pose changes, the directional indication changes accordingly.

[0025] In addition, in the present invention, the descriptions involving "first", "second" and so on are only for the purpose of description, and should not be understood as indicating or implying their relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined as ...

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PUM

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Abstract

The invention discloses a PCB thick copper plate segmented etching method. The method comprises steps that Step 1, 2 copper plates are selected, and the two copper plates are cut into the size required; Step 2, positioning holes, target holes and riveting holes are drilled at four corners of the copper plates, and single-sided mirror line patterns of both sides are made; Step 3, copper-tin platingis performed, and film removal etching is performed; Step 4, board surface browning is performed, the two sets of copper plates are riveted together through a semi-cured resin sheet, and hot pressingis performed; Step 5, the target holes and through holes are drilled, copper deposition and plate plating are performed, the through hole is plated with a layer of copper, upper and lower communication is performed, and a secondary line is made; and Step 6, secondary copper plating is performed, and film removal etching is performed to form a complete line pattern. The method is advantaged in that a problem of the residual copper burrs on the line after etching is solved, the residual copper burrs are minimized, and the range of the manufacturing line spacing of the thick copper plate is widened.

Description

technical field [0001] The invention relates to the technical field of PCB processing, in particular to a segmented etching method for a PCB thick copper plate. Background technique [0002] At present, the traditional process flow of PCB thick copper plate is: double-sided copper clad laminate cutting→drilling→circuit pattern→copper tin plating→removal film etching→AOI inspection→browning (blackening)→riveting→lamination→after PCB Process. [0003] The traditional manufacturing process is to directly use double-sided copper-clad laminates with ultra-thick copper (≥8oz) to drill holes, then plate the copper plate to make circuit patterns, and then do copper-tin plating and stripping etching, and then transfer to the post-production process. However, if the double-sided copper-clad laminate with ultra-thick copper is used directly, there will be a problem that the residual copper burr of the line will be too large when the ultra-thick copper is etched. The production range ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/02H05K3/06H05K3/42
CPCH05K3/022H05K3/06H05K3/429H05K2203/1476
Inventor 余波
Owner 深圳市众阳电路科技有限公司