Chip pickup equipment with buffer and reinforcement functions

Abstract

The invention relates to chip pickup equipment with buffer and reinforcement functions, which comprises a vacuum pump and a suction nozzle, and further comprises a buffer mechanism and a reinforcementmechanism, wherein the buffer mechanism includes a first suction pipe, a second suction pipe, a connecting hose and at least two buffer assemblies, each buffer assembly includes a second fixing block, a first fixing block, a connecting rod, a spring and a limit plate, the reinforcement mechanism includes a driving assembly and two fixing assemblies, each fixing assembly includes a first transmission rod, a second transmission rod and a supporting rod, and the driving assembly includes a motor, a lead screw, a driving block and two bearings. In the chip pickup equipment with the buffer and reinforcement functions, the pressure of the suction nuzzle on a chip is reduced under the buffer action of the buffer mechanism, so that the probability of being crushed of the chip is reduced, the practicability of the chip pickup equipment is improved, the probability of detachment of the suction nozzle is reduced under the reinforcement action of the reinforcement mechanism on the suction nozzle,and the practicability of the chip pickup equipment is further improved.

Description

technical field [0001] The invention relates to the field of chip pickup equipment, in particular to a chip pickup equipment with buffer and reinforcement functions. Background technique [0002] The semiconductor chip is to cut wafers of different sizes into predetermined sizes. In order not to mess up the cut semiconductor chips during cutting, the wafer is bonded with an adhesive holding tape on the back side, and the wafer is cut from the front side by a wafer cutting device. , Although the holding tape bonded to the back is cut into a little, it is not cut, and it becomes the state of holding each semiconductor chip. Next, each cut semiconductor chip is picked up from the holding tape by a chip sorter. During the picking process, the chip is first Lift up from the wafer, and then absorb the surface of the chip through the suction nozzle to achieve peeling and transfer. [0003] When the chip picking equipment of the prior art picks up the chip, the suction nozzle moves...

AI Technical Summary

Problems solved by technology

[0003] When the chip picking equipment of the prior art picks up the chip, the suction nozzle moves downward to contact the chip, and then the chip is sucked up by the suction nozzle. The pressure generated by the chip may cause the chip to be crushed, which reduces the practicability of the chip picking device. Not only that, when the operator installs the suction nozzle on the suction pipe, there is no reinforcement between the suction nozzle and the suction pipe. With the increase of time, the connection between the suction nozzle and the suction pipe becomes loose. During the high-speed movement of the suction pipe, the suction nozzle is prone to fall off under the action of inertia, which further reduces the practicability of the chip picking equipment.

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