Manufacturing device and grinding method for fine line multi-layer circuit board

Abstract

The invention discloses a manufacturing device for a fine line multi-layer circuit board, comprising a pressing device, a rotating device and a grinding device. The rotating device comprises a motor A(26), a reduction box (27), a vacuum pump (28), a bearing platform (29) and a hollow shaft (31). The output shaft of the motor A (26) and the input shaft of the reduction box (27) are connected by acoupling. A driving gear (32) is installed on the output shaft of the reduction box (27). The bearing platform (29) is internally provided with an L-shaped channel (33). One end of the L-shaped channel (33) runs through the top of the bearing platform (29), and the other end of the L-shaped channel (33) runs through the side wall of the bearing platform (29). A joint (34) is arranged at the port.The manufacturing device has the beneficial effects as follows: the grinding efficiency is improved; the labor intensity of workers is reduced; and the operation is simple.

Description

technical field [0001] The invention relates to the technical field of grinding four end faces of a multilayer circuit board, in particular to a manufacturing device and a grinding method for a fine circuit multilayer circuit board. Background technique [0002] Multilayer circuit boards are an indispensable and important part of electronic equipment. The manufacturing process of multilayer circuit boards is to use circuit substrates as raw materials and sequentially pass through flattening processes, edge grinding, pickling processes, and etching processes. The purpose of the edge grinding process is to polish the four end faces of the multilayer circuit board, and then remove the burrs on the end faces, so as to prevent the burrs from hurting people's hands or prevent scratches between the circuit boards, and further improve product quality. The existing way of grinding the four end faces of multilayer circuit boards is mostly manual operation, that is, workers use hand-he...

AI Technical Summary

Problems solved by technology

The existing way of grinding the four end faces of multilayer circuit boards is mostly manual operation, that is, workers use hand-held grinding wheels to grind along the length direction of the outer end faces of multilayer circuit boards. The end face is polished, but after each end face is polished, the multi-layer circuit board needs to be retooled, and then polished, so a total of four tooling is required to complete the grinding of the four end faces of the multi-layer circuit board, which undoubtedly increases the labor of the workers. Strength, while reducing the efficiency of end grinding

In addition, during manual grinding, due to fatigue factors, some areas have not been polished, so there are defects in grinding accuracy

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