A method for manufacturing an HDI rigid-flex board ink printing carrier

Abstract

The invention discloses a method for manufacturing an HDI rigid-flex board ink printing carrier, which belongs to the technical field of circuit boards, and mainly solves the technical problems of low manufacturing efficiency and high cost of rigid-flex board ink printing carriers. The method comprises the following steps, S1, etching copper bumps corresponding to the printing ink area on the copper substrate; S2, printing and bonding water glue on the top of the copper bumps, and covering the copper-free substrate on the copper substrate and make the copper-free substrate and the copper bumps fully bonded; S3, cutting (or electric milling) the substrate bumps corresponding to the printing ink area on the copper-free substrate to obtain the carrier. The invention can efficiently and accurately manufacture the HDI rigid-flex board ink printing carrier, and the manufacturing cost is low.

Description

technical field [0001] The invention relates to the technical field of circuit boards, more specifically, it relates to a method for manufacturing an HDI rigid-flex board ink printing carrier. Background technique [0002] At present, rigid-flex circuit boards are more and more used in mobile consumer portable electronics, but today, as the assembly space of electronic products is getting narrower and smaller, in order to better meet its 3D assembly requirements, some special structures have emerged. Multi-stage HDI rigid-flex circuit board. Their flexible areas generally have multiple and only two-layer circuits, which are short, small, light, thin, and soft. They need to be printed with photosensitive ink before exposure to meet the requirements of SMT laminating components. If these inks in the flexible area are exposed by silk screen printing when making the inner flexible board, they will easily melt and cause uneven thickness during the high-temperature pressing for s...

AI Technical Summary

Problems solved by technology

Generally, 500 to 1,000 bumps of different shapes need to be pasted on a substrate, and some bumps need to be pasted twice (such as red tape), which is time-consuming and laborious. In addition, the pre-preparation process seriously affects production efficiency and affects market competition. Competitiveness

If machine stickers are used, another set of machine sticker molds must be opened, and the steel sheets must be purchased as coiled steel sheets before machine stickers, and the purchase cost is relatively expensive.

Some customers will continue to change the product structure. Every time the customer changes the product, they will use the method mentioned above to make the substrate carrier, which will continue to increase the company's production cost and affect the production schedule.

Images