Special medium-Tg curing material used in field of lead-free preparation processes and use method thereof

A curing material and technology in the field, applied in the field of medium Tg special curing materials, can solve the problems of unsatisfactory heat resistance and moisture resistance, and achieve the effect of strong flame retardancy

Inactive Publication Date: 2019-08-13
NANTONG RODA ELECTRON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In order to meet the needs of PCB lead-free process, the heat resistance and moisture resistance of products made with a single curing agent dicyandiamide can no longer meet the requirements of higher performance printed boards. It is necessary to find a new performance. A new type of product to replace the traditional FR-4 products with a common Tg (glass transition point)

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0013] A medium Tg special curing material used in the field of lead-free process, including the following components by weight: 19.5g of ordinary low-bromine epoxy resin, 19.4g of modified multifunctional epoxy resin, 10.2g of phenolic resin, and 12.9g of acetone , butanone 12.9g, tetrabromopropanediol 3.6g, 2E4MZ0.015g, silane coupling agent KH560 0.021g, reinforcing agent boric acid 0.023g and filler silica 21.4g, the above one is used in the field of lead-free process The use process of the medium Tg special curing material is as follows: first dissolve the phenolic resin with the solvent methyl ethyl ketone, dissolve the tetrabromopropanediol and 2E4MZ with the solvent acetone, then add the filler, and mix thoroughly under high-shear stirring for more than 2 hours. After the dispersion is uniform and meets the requirements, add ordinary low-bromine epoxy resin and modified multifunctional epoxy resin, and then transfer to a static tank for further reaction for 3.5-4.5 hour...

Embodiment 2

[0015] A medium Tg special curing material used in the field of lead-free process, including the following components in parts by weight: 22g of ordinary low-bromine epoxy resin, 24g of modified multifunctional epoxy resin, 12.2g of phenolic resin, 12.8g of acetone, butyl Ketone 13.9g, tetrabromopropanediol 5.6g, 2E4MZ 0.015g, silane coupling agent KH560 0.021g, reinforcing agent boric acid 0.023g and filler silica 23.4g, the above one is used in the field of lead-free process The process of using Tg special curing material is as follows: first dissolve phenolic resin with solvent butanone, dissolve tetrabromopropanediol and 2E4MZ with solvent acetone, then add filler, mix thoroughly for more than 2 hours under high-shear stirring, and disperse evenly After meeting the requirements, add ordinary low-bromine epoxy resin and modified multifunctional epoxy resin, and then transfer to a static tank for further reaction for 3.5-4.5 hours. After aging, measure its SG between 280-320 ...

Embodiment 3

[0017] A medium Tg special curing material used in the field of lead-free process, including the following components by weight: 19.5g of ordinary low-bromine epoxy resin, 19.4g of modified multifunctional epoxy resin, 10.2g of phenolic resin, and 12.9g of acetone , butanone 12.9g, tetrabromopropanediol 3.6g, 2E4MZ0.015g, silane coupling agent KH560 0.021g, reinforcing agent boric acid 0.023g and filler silica 21.4g, the above one is used in the field of lead-free process The use process of the medium Tg special curing material is as follows: first dissolve the phenolic resin with the solvent methyl ethyl ketone, dissolve the tetrabromopropanediol and 2E4MZ with the solvent acetone, then add the filler, and mix thoroughly under high-shear stirring for more than 2 hours. After the dispersion is uniform and meets the requirements, add ordinary low-bromine epoxy resin and modified multifunctional epoxy resin, and then transfer to a static tank for further reaction for 3.5-4.5 hour...

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PUM

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Abstract

The invention discloses a special medium-Tg curing material used in the field of lead-free preparation processes. The material consists of common low-bromine epoxy resin, modified multifunctional epoxy resin, phenolic resin, acetone, butanone, tetrabromobisphenol, 2E4MZ, a coupling agent, a reinforcing agent and a filler. The material has the advantages that the modified epoxy resin and another bromophenol-containing curing agent tetrabromobisphenol are added into a common epoxy resin formula for synergistic action, and 2E4MZ(2-ethyl-4-methylimidazole) milder in curing speed than conventional2MZ(2-methylimidazole) is selected as a reaction accelerator, so that the 2E4MZ(2-ethyl-4-methylimidazole) is better matched with a product Tg of lead-free medium Tg at a glass transition point, and products produced by the material have stronger flame retardance.

Description

technical field [0001] The invention relates to the field of lead-free process, in particular to a medium Tg special solidified material used in the field of lead-free process and its application method. Background technique [0002] In order to meet the needs of PCB lead-free process, the heat resistance and moisture resistance of products made with a single curing agent dicyandiamide can no longer meet the requirements of higher performance printed boards, and it is necessary to find a new performance. A new type of product to replace the traditional common Tg (glass transition point) FR-4 products. Contents of the invention [0003] In order to solve the above-mentioned technical problems, the present invention adopts and provides a medium Tg special solidified material used in the field of lead-free process and its application method. [0004] The technical scheme adopted in the present invention is: [0005] A medium Tg special curing material used in the field of l...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08L61/06C08K3/38C08K3/36C08K3/22C08G59/62C08G59/68
CPCC08G59/621C08G59/686C08K2003/2224C08K2003/2227C08L63/00C08L2205/025C08L2205/03C08L61/06C08K3/38C08K3/36C08K3/22
Inventor 包晓剑
Owner NANTONG RODA ELECTRON
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