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Apparatus for confirming jet flow solder height and method of operation thereof

An operation method, jet welding technology, applied in welding equipment, manufacturing tools, printed circuit assembly of electrical components, etc., can solve the problem of jet wave height reduction, etc., and achieve the effect of easy adjustment, convenient portability, and simple structure

Active Publication Date: 2020-09-18
SENJU METAL IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, even if the jet flow soldering apparatus is operated after the height of the jet wave of molten solder is set to a desired height, if scum accumulates in the jet nozzle of the solder after a predetermined period of time and clogging occurs, The height of the jet wave sometimes decreases without changing the pressure of the jet pump

Method used

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  • Apparatus for confirming jet flow solder height and method of operation thereof
  • Apparatus for confirming jet flow solder height and method of operation thereof
  • Apparatus for confirming jet flow solder height and method of operation thereof

Examples

Experimental program
Comparison scheme
Effect test

no. 1 Embodiment approach

[0041] Such as figure 1 As shown, the jet soldering height confirmation tool 100 is a tool placed above the jet soldering apparatus 500 . Hereinafter, regarding the up-down (vertical) direction of the jet soldering apparatus 500, the side on which the jet solder height checking tool 100 is placed is referred to as an upper side, and the side opposite to this side is referred to as a lower side. As the jet soldering apparatus 500, an existing apparatus can be utilized. Jet flow soldering apparatus 500 includes, for example: substrate conveying parts 53, 54, which convey printed circuit board 60; jet flow solder tank 55; and housing 501, which accommodates jet flow solder tank 55. The upper surface is open.

[0042]The substrate conveying parts 53 and 54 place the printed circuit board 60 on the jet nozzle 56 from the figure 1 The printed circuit board 60 is conveyed so that the front side of the page faces the back side. The jet solder tank 55 includes a jet nozzle 56 hav...

no. 2 Embodiment approach

[0079] Next, the jet solder height checking tool 200 according to the second embodiment will be described with reference to the drawings. The solder jet height checking tool 200 is a modified example of the solder jet height checking tool 100 of the first embodiment, and differs from the solder jet height checking tool 100 mainly in the following points, that is, as follows: Figure 8 As shown, the pin 12 is composed of two pins 12g and 12h, and includes a notification member as a notification member. Figure 9 The external terminal 39B is shown sending a notification to the indicated communication means 39 . In the solder jet height checking tool 200 , the same components as those of the solder jet height checking tool 100 according to the first embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.

[0080] Jet flow solder height confirmation device 200 with figure 1 The illustrated solder jet height confirmation device 10...

no. 3 Embodiment approach

[0104] Next, a jet solder height confirmation tool 300 according to a third embodiment will be described with reference to the drawings. The solder jet height checking tool 300 is a modified example of the solder jet height checking tool 100 of the first embodiment. Figure 10 As shown by the arrow D in the arrow D, the jet solder height confirmation tool 300 is similar to the jet solder height confirmation tool in that the sliding member 11E and the plurality of pins 12 can rotate relative to the bridge member 40B, and the structure of the pin holding member 14B and the notification part 30B. 100 is very different. In the solder jet height checking tool 300 , the same components as those of the solder jet height checking tool 100 according to the first embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.

[0105] Jet Solder Height Confirmation Tool 300 with figure 1 The shown jet solder height checking tool 100 is the sam...

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PUM

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Abstract

The present invention provides a jet solder height checking tool capable of accurately adjusting the height of a jet wave of molten solder, and an operating method thereof. The jet solder height confirmation device (100) includes: a height confirmation part (10) for confirming the height of the jet wave of molten solder (7); an insulating holding part (20) for holding the height confirmation part (10); the notification part (30), which is connected to the height confirmation part; and the conductive bridging member (40), which has a metal member (51) capable of bridging and conducting with the container containing the molten solder (7). , 52), the bridging member (40) supports the height confirmation part (10) so as to be movable between the metal members (51, 52). The height confirming part (10) includes: a conductive sliding member capable of sliding in a direction perpendicular to the length direction of the bridging member; and a plurality of pins (12) having conductivity, the plurality of pins (12) It is arranged under the sliding member. The plurality of pins (12) are arranged such that the respective top ends of the plurality of pins (12) have different heights in the jet flow direction of the jet wave of molten solder (7).

Description

technical field [0001] The present invention relates to a jet solder height checking device capable of setting and maintaining the set jet wave height for molten solder jet waves in a jet soldering device and an operating method thereof, and an operating method thereof The height of the wave is uniform and applied. Background technique [0002] Conventionally, when soldering electronic components to a predetermined surface of a printed circuit board, a jet soldering apparatus is often used. In the jet soldering apparatus, a flux applicator, a preheater, a jet soldering processing unit, a cooler, and the like are arranged at predetermined positions. When using this jet soldering apparatus to solder electronic components on a printed circuit board, first, the distance from the jet solder tank of the jet soldering processing unit to the conveyance position of the printed circuit board is Corresponding to the height, the height of the jet wave of molten solder is set. [0003...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K1/08B23K1/00B23K3/06H05K3/34B23K101/42
CPCB23K1/00B23K1/08B23K3/06H05K3/34
Inventor 铃木良一川岛泰司小峰滋男杉原崇史半泽编理
Owner SENJU METAL IND CO LTD