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Board automatic loading and unloading machine for semiconductor 3D package plating process

A semiconductor and 3D technology, applied in the field of automatic loading and unloading of sheet materials, can solve the problems of difficult operation, complex structure, and the accuracy of the upper plate and the upper plate do not meet the requirements, and achieve the effect of easy operation, simple structure, and easy automatic control.

Pending Publication Date: 2019-08-16
GREAT CHIEFTAIN ELECTRONICS MACHINERY
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AI Technical Summary

Problems solved by technology

[0002] In the traditional electroplating process of the semiconductor 3D packaging industry, the loading and unloading of the material board is mostly manual operation. As a result, sometimes the accuracy of the upper board and the upper board does not meet the requirements.
At present, there are also parts that use the automatic loading and unloading of the material plate, but the feeding and unloading mechanisms of the machine are separated, the structure is quite complicated and the operation is difficult

Method used

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  • Board automatic loading and unloading machine for semiconductor 3D package plating process
  • Board automatic loading and unloading machine for semiconductor 3D package plating process
  • Board automatic loading and unloading machine for semiconductor 3D package plating process

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Embodiment Construction

[0044] see Figure 1 to Figure 14 , the embodiment of the automatic loading and unloading of the material plate for the semiconductor 3D packaging electroplating process of the present invention includes:

[0045] a base 1 with a horizontal top platform;

[0046] A rotating platform 2 has a horizontal top support plate 201, the rotating platform is rotatably supported on the top platform of the base 1 through bearings and is driven by a controllable rotating motor 202;

[0047] An existing hanger 3 is a rectangular board that can be erected, and is used to clamp the material board and supply power to the material board;

[0048] A hanger positioning support seat 4 is fixed on the top support plate 201 of the rotating platform 2. It has a horizontal elongated base plate, two ends are symmetrically provided with vertical plates, the top surface of the elongated base plate and two vertical plates There is a groove 401 on the inner surface of the plate, which can be inserted int...

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Abstract

The invention discloses a board automatic loading and unloading machine for a semiconductor 3D package plating process. The board automatic loading and unloading machine comprises a base (1), a rotating platform (2), a hanging frame (3), a hanging frame positioning support seat (4), a suction cup overturning device (5), a suction cup (6), a propulsion device (7) and an industrial control machine (8). The invention can realize the automatic integration of loading and unloading, the accuracy of board loading and unloading meets requirements, the structure is simple and the operation is convenient, and the automatic control of equipment is easy to realize.

Description

technical field [0001] The invention relates to an automatic plate loading and unloading machine, in particular to an automatic plate loading and unloading machine used in the semiconductor 3D packaging electroplating process. Background technique [0002] In the traditional electroplating process of the semiconductor 3D packaging industry, the loading and unloading of the material board is mostly manual operation. As a result, sometimes the upper board and the accuracy of the upper board do not meet the requirements. At present, there are also parts that use the automatic loading and unloading of the material plate, but the feeding and unloading mechanisms of the machine are separated, the structure is quite complicated and the operation is difficult. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide an automatic loading and unloading machine for the semiconductor 3D packaging electroplating process, which can not...

Claims

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Application Information

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IPC IPC(8): H01L21/677
CPCH01L21/67742H01L21/6776
Inventor 邓高荣
Owner GREAT CHIEFTAIN ELECTRONICS MACHINERY
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