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A cutting device for substrate cutting

A technology for cutting equipment and substrates, applied in metal processing, etc., which can solve problems such as inability to improve work efficiency, complex structure, and high manufacturing costs

Active Publication Date: 2020-09-29
安徽元昌电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to solve the above-mentioned technical problems, the present invention provides a cutting device for substrate cutting to solve the existing complex structure and high manufacturing cost, and the existing cutting device for substrate cutting cannot Fix several substrates at the same time, and then perform the same cutting, which cannot improve work efficiency

Method used

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  • A cutting device for substrate cutting
  • A cutting device for substrate cutting
  • A cutting device for substrate cutting

Examples

Experimental program
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Embodiment

[0031] as attached figure 1 to attach Figure 8 Shown:

[0032]The present invention provides a cutting device for substrate cutting, including: a main body 1, a universal wheel 101, a side chute 102, a notch 103, a chute 104, a collection bin 2, a handle 201, a fixing part 3, a stopper Plate 301, mounting plate 302, outrigger spring 303, clip 4, slot 401, pad 402, sliding rod 5, support rod 501, moving slot 502, sliding piece 6, moving hole 601, fixing hole 602, moving column 7. Top plate 701, support spring 702, limit plate 703, limit hole 704, limit member 705, receiving plate 8, motor 801 and saw blade 802; main body 1 is a rectangular internal hollow structure, and the bottom corner of main body 1 The location is installed with universal wheels 101 by welding, and the top of both sides of the main body 1 is provided with rectangular notches 103. The collection bin 2 is installed on the inner bottom of the main body 1 by embedding; the fixing part 3 is installed by embed...

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PUM

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Abstract

The invention provides cutting equipment for substrate cutting. The cutting equipment comprises a moving column, a top plate, a supporting spring, a limiting plate, a limiting hole, a limiting piece,a bearing plate, a motor and a saw web; the middle position of the moving column is installed in a moving hole formed in the middle position of a slide piece in an installed mode, the limiting piece is inserted into the limiting hole, and the bottom of the moving column is installed in the middle of the upper portion of the bearing plate in a welding mode; the bearing plate is of a rectangular plate structure, the bottom of the bearing plate is fixedly connected with the motor, and the motor is connected with the saw web through a transmission rod; and clamping pieces are used for installing and fixing substrates, the multiple substrates are fixed by the clamping pieces at the same time and then are simultaneously cut, the working efficiency is improved, clamping grooves formed in the inner sides of the clamping pieces are used for allowing the side edges of the substrates to be inserted, the substrates can be fixed at the same time, and clamping pads made of rubber are installed in the clamping grooves in an adhesion mode.

Description

technical field [0001] The invention belongs to the technical field of substrate cutting equipment, and more specifically relates to cutting equipment for substrate cutting. Background technique [0002] The substrate is the basic material for manufacturing PCBs. In general, the substrate is a copper-clad laminate. Single- and double-sided printed boards are manufactured in the substrate material-copper-clad laminates (Copper-2lad I. aminates, CCI. ), selectively carry out hole processing, electroless copper plating, electroplating copper, etching and other processing to obtain the required circuit pattern. The manufacture of another type of multi-layer printed board is also based on the inner core thin copper clad laminate, and the conductive pattern layer and the prepreg (Pregpr'eg) are alternately laminated together by one-time lamination to form more than 3 layers of conductive Interconnection between graphics layers. It has three functions of conduction, insulation an...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B26D1/18B26D7/02B26D5/02B26D7/26B26D7/00
CPCB26D1/18B26D5/02B26D7/0006B26D7/02B26D7/2635
Inventor 赵小军
Owner 安徽元昌电子科技有限公司