Low-resistance flexible circuit board circuit manufacturing process

Abstract

The invention discloses a circuit manufacturing process for a low-resistance flexible circuit board. The manufacturing process comprises the following steps: firstly, etching a circuit on a copper-clad film; setting opening holes corresponding to the two ends of the circuit in an insulating cover film, enabling the handle to cover the insulating cover film and to be attached to the copper-clad film, and enabling the two ends of the circuit on the copper-clad film to be exposed out of the insulating cover film through the opening holes; printing a windowed first image-text on the surface of thecovering film by using a conductive material and curing the windowed first image-text, wherein one pole of the circuit is located in the window and forming a gap between the one pole of the circuit and the windowed, and the first image-text covers the surface of the other pole of the circuit; printing a second image-text on the upper circuit film by using a conductive material and curing the second image-text; enabling the upper circuit film to be fixedly attached to the insulating cover film, wherein the second image-text on the upper circuit film is just opposite to and in close contact with the first image-text, and the second image-text can be opposite to one pole of the circuit on the copper-clad film through the first image-text window. The process is simple, the manufacturing is convenient, and the stability of the manufactured circuit board finished circuit is high.

Description

technical field [0001] The invention relates to a circuit board technology, in particular to a low-resistance flexible circuit board circuit manufacturing process. Background technique [0002] The traditional manufacturing process of the circuit board circuit is as follows: take a single-sided copper-clad film to etch the gate circuit 12, and then add a piece of PET film printed with conductive silver paste to design and manufacture the switch circuit. In this process, the gate of one pole of the circuit is The lines are thin and the spacing is narrow, which is easy to cause open circuit or short circuit due to poor etching. After the other electrode material of the line is etched, the strength of the substrate is reduced and deformation occurs, which is prone to false touches, resulting in poor stability of the gate line, and the finished product must be Only when at least two sets of wires are connected can a signal be generated, resulting in low stability of the circuit ...

AI Technical Summary

Problems solved by technology

[0002] The traditional manufacturing process of the circuit board circuit is as follows: take a single-sided copper-clad film to etch the gate circuit 12, and then add a piece of PET film printed with conductive silver paste to design and manufacture the switch circuit. In this process, the gate of one pole of the circuit is The lines are thin and the spacing is narrow, which is easy to cause open circuit or short circuit due to poor etching. After the other electrode material of the line is etched, the strength of the substrate is reduced and deformation is caused, which is prone to false touches, resulting in poor stability of the gate line, and the finished product must be Only when at least two sets of wires are connected can a signal be generated, resulting in low stability of the circuit board product and prone to failure

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