Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Mass wafer fixing device and driving device in magazine-free cleaning equipment and use method

A technology for cleaning equipment and wafer fixing. It is used in transportation and packaging, semiconductor/solid-state device manufacturing, conveyor objects, etc., and can solve problems such as the inability to achieve wafer batch limit operations.

Active Publication Date: 2019-08-27
BEIJING SEMICON EQUIP INST THE 45TH RES INST OF CETC
View PDF9 Cites 7 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The first purpose of the present invention is to provide a batch wafer fixing device in a cassette-less cleaning equipment, in order to solve the technical problem that the batch-limiting operation of wafers cannot be realized in the existing cassette-free cleaning equipment

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Mass wafer fixing device and driving device in magazine-free cleaning equipment and use method
  • Mass wafer fixing device and driving device in magazine-free cleaning equipment and use method
  • Mass wafer fixing device and driving device in magazine-free cleaning equipment and use method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0048] This embodiment provides a batch wafer fixing device in a cassetteless cleaning equipment, such as figure 1 with figure 2 As shown, the batch wafer fixing device in the cassette-less cleaning equipment includes a positioning seat 100. The positioning seat 100 is provided with a plurality of trough structures 110 for accommodating wafers; the bottom surface of the trough structure 110 is connected to the wafer With the arc-shaped surface matched with the arc-shaped edge, the groove depth of the groove structure 110 is smaller than the radius of the wafer.

[0049] In the batch wafer fixing device in the cassette-less cleaning equipment, a plurality of tank structures 110 for accommodating wafers are provided on the positioning seat 100, wherein one wafer can be placed in a tank structure 110, Since the bottom surface of the slot structure 110 fits the arc-shaped edge of the wafer, the slot structure 110 can limit the wafer to a certain extent, so that the relative position ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a mass wafer fixing device and a mass wafer driving device in magazine-free cleaning equipment and a use method, and relates to the technical field of wafer cleaning equipment.The mass wafer fixing device and the mass wafer driving device and the use method solve the technical problem that mass limiting operation of wafers cannot be achieved in the existing magazine-free cleaning equipment. The mass wafer fixing device in the magazine-free cleaning equipment comprises positioning seats, wherein a plurality of groove body structures for accommodating the wafers are arranged on the positioning seats; the bottom surfaces of the groove body structures are arc surfaces adapted to the arc edges of the wafers; and groove depths of the groove body structures are less than semidiameters of the wafers. The mass wafer driving device in the magazine-free cleaning equipment comprises the fixing device. The use method of the mass wafer driving device in the magazine-free cleaning equipment comprises the following steps: limiting the wafers, and driving the positioning seats to move horizontally and up and down. The mass wafer fixing device and the mass wafer driving device in the magazine-free cleaning equipment and the use method can achieve the mass limiting operation for the wafers.

Description

Technical field [0001] The present invention relates to the technical field of wafer cleaning equipment, in particular to a batch wafer fixing and driving device and a method of use in a cassetteless cleaning equipment. Background technique [0002] With the development of the semiconductor industry and the continuous shrinking of the key dimensions of the device process technology, there are higher requirements for the cleanliness of the wafer in each processing process. [0003] The current wet cleaning of wafers can be divided into three methods: multi-tank, rotary rinse and spin-drying, and single-wafer corrosion cleaning. In recent years, with the continuous upgrading and improvement of wet chemical equipment, trough cleaning has an important position with its efficient working method. [0004] In order to meet the requirements for high cleanliness of the wafer surface in the wafer processing technology, wet chemical cleaning equipment has developed a wafer-less cleaning proces...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/02H01L21/67H01L21/673H01L21/677H01L21/687
CPCH01L21/02041H01L21/67023H01L21/68735H01L21/68771H01L21/677H01L21/673
Inventor 赵宝君秦亚奇郭立刚艾海丰周福江
Owner BEIJING SEMICON EQUIP INST THE 45TH RES INST OF CETC
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com