Display screen based on COB packaging structure and packing method adopted by display screen

Abstract

The invention provides a display screen based on a COB packaging structure and a packing method adopted by the display screen. The display screen comprises a PCB, a plurality of drive chips, a currentsource, a plurality of LED chips and a face cover, wherein a plurality of hole cups in array distribution are arranged on the face cover, the inner diameters of the hole cups are increased in the sequence from bottom to top, the lower half parts of the inner walls of the hole cups are subjected to frosting treatment, the upper half parts of the inner walls of the hole cups are subjected to mirrorsurface treatment, the bottom surface of the face cover is fixed to the upper surface of the PCB through epoxy resin, each LED chip is located in one corresponding hole cup, and a sealant is injectedinto the hole cups. Compared with the prior art, the technical scheme provided by the invention has the beneficial effects that the traditional double-face-cover structure is simplified into the single-face-cover structure, so that the cost is reduced, the thickness is reduced, then the light ray mixing is more uniform, the problems including polarized light and cross color are reduced, the lightray loss ratio is reduced, the luminance is increased, and meanwhile, the distance connecting each two hole cups can be reduced.

Description

[0001] 【Technical field】 [0002] The invention relates to the technical field of LED display screens, in particular to a display screen based on a COB packaging structure and a packaging method thereof. [0003] 【Background technique】 [0004] COB: Chip On Board packaging technology (abbreviation in English), which can also be understood as: a luminous body in which multiple LED chips are integrated and packaged on the same substrate. COB integrated packaging is a new type of LED packaging method, but with the application of LED products in the lighting field, COB surface light sources will definitely be the mainstream product in the packaging industry in the future. [0005] The Chinese invention with the application number CN201811097517.1 discloses a COB display screen and a packaging method thereof, using a PCB board with a light-emitting chip, a first mask with a first mask hole, and a second mask with a second mask hole. The masks are stacked in sequence, the inner diam...

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Problems solved by technology

[0006] However, this structure adopts a double-sided mask, which will double the thickness of the LED display screen, and the processing difficulty and cost are also high; the light loss rate is too high, that is, because the inner diameter of the second mask hole is smaller than the first mask hole, the light emitted by the light-emitting chip Part of it cannot be emitted out of the mask hole due to too much reflection, and the distance between two adjacent light-emitting chips will be large, resulting in reduced brightness and image quality

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