an etching device
An etching device and etching technology, used in transportation and packaging, electrical components, conveyor objects, etc., can solve problems such as reducing product yield
Active Publication Date: 2021-10-01
TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
View PDF0 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0003] However, the side wall of the etching chamber of the existing etching device is provided with a barrier. When entering the soaking mode from the spray mode, the substrate needs to be moved into the etching chamber through the rollers. Since the position of the rollers is low, it is necessary to move the inlet side to the etching chamber. The blocking part of the moving down, so that the roller can transfer the substrate into the etching chamber, and when the blocking part on the entrance side moves down, the liquid level of the etching liquid in the etching chamber will drop, so it is easy to produce mura during etching, reducing the product quality. Yield
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0014] The following descriptions of the various embodiments refer to the accompanying drawings to illustrate specific embodiments in which the present invention can be practiced. The directional terms mentioned in the present invention, such as "up", "down", "front", "back", "left", "right", "inside", "outside", "side", etc., are for reference only The orientation of the attached schema. Therefore, the directional terms used are used to illustrate and understand the present invention, but not to limit the present invention. In the figures, structurally similar units are denoted by the same reference numerals.
[0015] Such as figure 1 As shown, the etching device 100 of the present invention is a wet etching device, which includes an etching chamber 10 , a shower part 20 , a liquid knife 30 , a substrate 40 and a transfer device.
[0016] Etching solution is contained in the etching chamber 10; an inlet 14 and an outlet 15 are respectively arranged on two opposite side wal...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The present invention provides an etching device, which comprises: an etching chamber containing an etching solution; two opposite side walls of the etching chamber are respectively provided with an inlet and an outlet, and the position of the outlet is the same as that of the etching chamber. The position of the entrance corresponds; the exit and the entrance are provided with a blocking portion, the blocking portion includes a first sub-blocking portion and a second sub-blocking portion, the first sub-blocking portion is located at the exit or A side of the entrance close to the substrate, wherein a substrate is arranged in the etching chamber; a transmission device is arranged below the substrate, and the transmission device includes at least one first roller and at least one second roller, so The diameter of the first roller is larger than the diameter of the second roller, and the initial height of the top of the first roller is equal to the initial height of the top of the first sub-blocking part. The etching device of the present invention can avoid generation of Mura during etching and improve product yield.
Description
【Technical field】 [0001] The invention relates to the field of display technology, in particular to an etching device. 【Background technique】 [0002] The production of the display panel includes an etching process, and the etching includes wet etching and dry etching. Currently, wet etching modes include a spraying mode, a soaking mode and a coating mode. [0003] However, the side wall of the etching chamber of the existing etching device is provided with a barrier. When entering the soaking mode from the spray mode, the substrate needs to be moved into the etching chamber through the rollers. Since the position of the rollers is low, it is necessary to move the inlet side to the etching chamber. The blocking part of the moving down, so that the roller can transfer the substrate into the etching chamber, and when the blocking part on the entrance side moves down, the liquid level of the etching liquid in the etching chamber will drop, so it is easy to produce mura during e...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67H01L21/677
CPCH01L21/6708H01L21/67742H01L21/6776
Inventor 林钦遵
Owner TCL CHINA STAR OPTOELECTRONICS TECH CO LTD