Electronic device cover plate and preparation method thereof, and electronic device
A technology for electronic equipment and cover plates, which is applied in the direction of casing/cabinet/drawer parts, etc., can solve the problems that the impact resistance requirements of electronic equipment casings cannot be effectively met, sapphire needs to be further studied, and the cost is high.
Inactive Publication Date: 2019-08-30
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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- Description
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- Application Information
AI Technical Summary
Problems solved by technology
[0002] Due to its beautiful appearance, high hardness and good wear resistance, sapphire has a good application prospect in electronic equipment casings, but currently sapphire is difficult to process, high in cost, and relatively brittle, especially With the development trend of thinner and lighter electronic equipment, the smaller the thickness of sapphire, the worse the impact resistance, which cannot effectively meet the impact resistance requirements of electronic equipment casings
[0003] Therefore, the current application of sapphire in electronic equipment still needs to be further studied.
Method used
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Embodiment 1
[0028] On one surface of a sapphire substrate with a thickness of 0.3 mm, an OCO organic strengthening layer with a thickness of 3.8 microns is sprayed to obtain an electronic equipment cover plate. A 110g steel ball drop test was performed on the center and four corners of the obtained electronic equipment cover, and each experiment was repeated 5 times. The test results are shown in Table 1 below, where the height indicates the failure height of the electronic equipment cover steel ball dropped.
[0029] Table 1
[0030]
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Abstract
The invention provides an electronic device cover plate and a preparation method thereof, and an electronic device. The electronic device cover plate comprises: a sapphire substrate; and an organic strengthening layer arranged on at least one portion of the surface of the sapphire substrate. The toughness of organic strengthening layer is better and has better shock resistance, and the organic strengthening layer can restore the microcrack and the damage produced in the sapphire substrate processing process and avoids microcrack and damage when receiving the impact to enlarge and lead to the sapphire substrate to be cracked so that the electronic device has good steel ball falling performance (namely shock resistance), and even though the sapphire substrate is thin, the shock resistance requirement of the electronic device can be met, the requirement of lightness and thinness can be met and the cost is low.
Description
technical field [0001] The invention relates to the technical field of electronic equipment, and in particular, to an electronic equipment cover plate, a preparation method thereof, and an electronic equipment. Background technique [0002] Due to its beautiful appearance, high hardness and good wear resistance, sapphire has a good application prospect in electronic equipment casings, but currently sapphire is difficult to process, high in cost, and relatively brittle, especially With the development trend of thinner and lighter electronic equipment, the smaller the thickness of sapphire, the worse the impact resistance, which cannot effectively meet the impact resistance requirements of electronic equipment casings. [0003] Therefore, the related application of sapphire in electronic equipment still needs further research. Contents of the invention [0004] The present invention aims to solve one of the technical problems in the related art at least to a certain extent....
Claims
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IPC IPC(8): H05K5/03C04B41/48
CPCC04B41/009C04B41/48C04B41/4905H05K5/03C04B14/303
Inventor 杨自美
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD