Computer keyboard bonding component and production technology thereof

Abstract

The invention relates to a computer keyboard bonding component, which comprises a base release film, a first double-sided adhesive layer, a second double-sided adhesive layer and a surface release film. Specifically, the first double-sided adhesive layer is a layer of adhesive tape attached to the base release film and located at the bottom edge of a keyboard space key; the second double-sided adhesive layer is a latticed adhesive layer that is attached to the base release film and corresponds to the spacing regions between the keyboard keys, fracture parts form at four corners of each grid inthe latticed adhesive layer, and circular through-holes corresponding to the fracture parts of the latticed adhesive layer are molded on the base release film; and a protruding second handle part ismolded at a long side edge of the surface release film. According to the invention, through the above-mentioned structure and technology, two different adhesives are prepared on the same release film,the air waste discharge and repasting process of circular knives is employed for integrated molding of the product, thus ensuring the dimensional precision of the product, also saving time, improvingthe efficiency, reducing waste and saving the cost.

Description

[0001] Technical field: [0002] The invention relates to the technical field of die-cutting products, in particular to buffer bonding components used in electronic products such as Mac keyboards and Mac homepods, in particular to a computer keyboard bonding component and its production process. [0003] Background technique: [0004] The existing KB PSA connection module assembly for Mac keyboard and Mac Homepod assembly, after KB PSA is formed, it is generally in the shape of a whole cuboid, and the inside is composed of many small square hollow glues to form mesh glues of different sizes. . [0005] There are two handles on the middle layer of release film in the width direction, which is convenient for assembly; the traditional processing technology generally adopts die-cutting processing, KB PSA connects the module, and KBPSA is made of a layer of blue release film. Formed film and a layer of transparent release film, with a layer of 0.15MM and 0.10MM black double-sided a...

AI Technical Summary

Problems solved by technology

[0006] 1. According to the traditional die-cutting process, the product is divided into 3 to 4 steps to cut the small square hole in the middle. The bottom film needs to be replaced in each step, which wastes materials and high cost; it affects production efficiency, and each step is manually cut. The waste is discharged, and the tape will be wrinkled and scrapped when the waste is manually discharged.

[0007] 2. Then put the waste glue of the square hole in the middle, turn the bottom film, cut off the connecting ribs at the four corners of the square hole, and discharge the waste. Since the width of each glue is relatively small, it is easy to remove the tape during waste discharge, resulting in scrapped

[0008] 3. When cutting the entire outer frame of the product, discharge the waste of the outer frame. The structure in the middle of the product is relatively weak, and it is easy to take away the rubber strips on the side when discharging waste, resulting in scrapping

The product and the shipping release film need to be processed separately, and then assembled together. There are many processes, and the assembly efficiency of the transparent release film is relatively low, and more jigs are required, which increases manpower and working hours. Compare the impact on production efficiency

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