Multi-chip package structure and manufacturing method thereof

Abstract

The invention discloses a multi-chip package structure. The multi-chip package structure comprises a plastic package layer, a first chip, a connection plate, a second chip, a glue filling layer, a rewiring layer, a dielectric layer and an external welding ball, wherein the first chip is coated in the plastic package layer and is provided with a first pin and a second pin, a first surface of the connection plate is connected with the plastic package layer, a chip embedment groove and a conductive through hole are formed in the connection plate, the conductive through hole is electrically connected with the first pin of the first chip, the second chip is arranged in the chip embedment groove of the connection plate and is electrically connected with the second pin of the first chip, the gluefilling layer is filled in a gap between the second chip and the chip embedment groove and covers the second chip, the rewiring layer is arranged on the second surface of the connection plate and iselectrically connected with the conductive through hole, the dielectric layer is arranged on the second surface of the connection plate and is used for insulation protection among layers of the rewiring layers and among same-layer metal, and the external welding ball is electrically connected with the rewiring layer.

Description

technical field [0001] The invention relates to the technical field of chip packaging, in particular to a multi-chip packaging structure and a manufacturing method thereof. Background technique [0002] With the development of further miniaturization of electronic products, the solution of interconnecting multiple chips through a PCB substrate is gradually replaced by a multi-chip module (MCM) in many cases. A multi-chip module (MCM) refers to a component in which multiple integrated circuit chips are electrically connected to a common circuit substrate and uses it to realize interconnection between chips. It is a typical highly integrated component. Each chip in these components is usually unsealed assembled on a multilayer interconnected substrate by wire bonding, tape bonding or flip-chip, and then plastic-encapsulated to form a packaging structure. Compared with mounting the chip directly on the PCB, MCM has certain advantages. For example: (1) shortens the transmissio...

AI Technical Summary

Problems solved by technology

[0003] Although multi-chip modules have many advantages, the existing multi-chip packaging structure is still based on substrate, wire bonding and other technologies, and its packaging volume and interconnection distance between multi-chips are still relatively large.

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