Check patentability & draft patents in minutes with Patsnap Eureka AI!

Manufacturing method of trapezoidal plate

A manufacturing method and technology of trapezoidal boards, which are applied in the fields of printed circuit manufacturing, electrical components, printed circuits, etc., can solve problems such as inability to guarantee

Inactive Publication Date: 2019-09-06
江西景旺精密电路有限公司
View PDF7 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

There is no guarantee that the uncovered area of ​​the lower board can meet the requirements of all printed circuit boards for product surface solder mask, characters, surface treatment, and stickers

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Manufacturing method of trapezoidal plate
  • Manufacturing method of trapezoidal plate
  • Manufacturing method of trapezoidal plate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0027] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention, and similar component numbers in the drawings represent similar components.

[0028] It should be understood that when used in this specification and the appended claims, the terms "comprising" and "comprises" indicate the presence of described features, integers, steps, operations, elements and / or components, but do not exclude one or Presence or addition of multiple other features, integers, steps, operations, elements, components and / or collections thereof.

[0029] It should also be understood that the terms used in the description of the embodiments of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the embodiments of the present invention. As used in the description of the embodiments of the present invention an...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a manufacturing method of a trapezoidal plate, and relates to the technical field of PCB manufacturing. The method comprises the following steps: S1, carrying out first blind fishing in a blind fishing area of an upper plate 1, wherein the depth of the first blind fishing is smaller than the thickness of the upper plate; S2, laminating pure adhesive to the upper plate, wherein the laminated position of the pure adhesive corresponds to a non-blind fishing area of the upper plate; S3, laminating the upper plate to a lower plate through the pure adhesive, wherein a fishingarea is formed between the upper plate and the lower plate; and S4, carrying out second blind fishing on the blind fishing area of the upper plate, wherein the blind fishing area of the upper plate is fished in the second blind fishing. According to the trapezoidal plate manufactured through the technical scheme provided by the invention, the upper plate is independent in the center of the lowerplate without a connection position, the design of the upper plate and the lower plate is not influenced by the trapezoidal plate, and all requirements of all printed circuit boards on solder resist / character / surface treatment and SMT attached pieces can be met in the uncovered regions of the upper plate and the lower plate while any combination of the trapezoidal plate is realized to the maximumextent.

Description

technical field [0001] The invention relates to the technical field of manufacturing a multilayer PCB trapezoidal board, in particular to a method for manufacturing a trapezoidal board. Background technique [0002] The traditional trapezoidal board adopts laser cutting method to remove the unnecessary area on the uncovered area of ​​the upper board. Due to the process tolerance, some PP / pure glue remains on the surface of the uncovered area. There is no guarantee that the uncovered area of ​​the lower board can meet the requirements of all printed circuit boards for product surface solder mask, characters, surface treatment, and stickers. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a method for manufacturing a trapezoidal plate, so that the uncovered areas of the lower plate and the upper plate can meet all the requirements of the hard plate. [0004] In order to solve the above problems, the present invent...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K3/00
CPCH05K3/0044H05K2203/0228
Inventor 潘晓勋周锋王正坤
Owner 江西景旺精密电路有限公司
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com