Manufacturing method of flexible circuit board capable of removing appearance deburring of base material

Abstract

The invention discloses a manufacturing method of a flexible circuit board capable of removing the appearance deburring of a base material. The manufacturing method comprises the following steps: carrying out blanking of the base material; carrying out hole drilling of the base material; electroplating copper inside through holes; manufacturing circuits on the upper surface and the lower surface of the base material according to requirements respectively, and enabling the circuit on the upper surface to be electrically connected with the circuit on the lower surface through the copper inside the through holes; carrying out blanking of a cover film; carrying out windowing of the cover film; carrying out CVL: laminating the prepared cover film CVL to the upper surface and the lower surface of the base material, and then carrying out lamination by using a quick pressure machine according to requirements; then carrying out baking solidification by using an oven according to required temperature and time, wherein the temperature is 150 to 160 DEG C, and the time is 50 to 60 min; punching positioning holes by using a perforating machine; carrying out gold treatment: carrying out surfacetreatment on a copper surface in which windowing holes are formed according to requirements so as to prevent rusting; carrying out solder resist: printing ink in the areas, corresponding to the positions needing formation and cutting, on the cover film; carrying out blanking of a stiffening plate; carrying out laser; carrying out FR4 reinforcing; carrying out fly needle test; and carrying out CNCforming. According to the manufacturing method, deburring can be avoided from being generated on the FPC edge of the base material during forming.

Description

technical field [0001] The invention relates to an improvement of a manufacturing method of a flexible circuit board, in particular to a manufacturing method of a flexible circuit board capable of removing burrs from the base material shape and avoiding burrs on the edge of the base material FPC during molding. Background technique [0002] In the prior art, in the final molding process of the flexible circuit board, burrs often occur on the edge of the base material FPC, which affects the appearance of the flexible circuit board. [0003] For this reason, we have developed a method for manufacturing a flexible circuit board that can remove the burr from the base material shape and avoid the burr on the edge of the base material FPC during molding. Contents of the invention [0004] In view of the above-mentioned technical problems, the object of the present invention is to propose a method for manufacturing a flexible circuit board capable of removing the burr from the ba...

AI Technical Summary

Problems solved by technology

[0002] In the prior art, in the final molding process of the flexible circuit board, burrs are often generated on the edge of the substrate FPC, which affects the appearance of the flexible circuit board

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