Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Glass substrate cutting machine

A glass substrate and cutting machine technology, applied in glass cutting devices, glass manufacturing equipment, manufacturing tools, etc., can solve problems such as affecting the service life of the cutting knife, affecting the quality of the glass substrate, and inability to eliminate glass dust, reducing the possibility of, The effect of prolonging the service life and improving the quality

Active Publication Date: 2022-01-28
WUHU TUNGHSU PHOTOELECTRIC SCI & TECHCO +1
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the prior art, the cutting knife directly cuts the annealed glass substrate. At this time, the cutting area of ​​the glass substrate presents a temperature distribution with low temperature at both ends and high temperature in the middle. Accumulated at the transition position between them, resulting in a large amount of glass dust attached to the surface of the glass substrate, and the attached glass dust cannot be eliminated in the subsequent cleaning and dust removal process of the glass substrate, seriously affecting the quality of the glass substrate
In addition, when the cutting knife cuts when the temperature in the cutting area is not uniform, it will also cause greater wear to the cutter wheel of the cutting knife, thus affecting the service life of the cutting knife

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Glass substrate cutting machine
  • Glass substrate cutting machine
  • Glass substrate cutting machine

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0039] Specific embodiments of the present disclosure will be described in detail below in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are only used to illustrate and explain the present disclosure, and are not intended to limit the present disclosure.

[0040] In the present disclosure, the orientation words used such as "inside and outside" refer to the inside and outside of the corresponding structure or component outline unless stated otherwise. In addition, terms such as "first", "second" and the like are used to distinguish one element from another, and do not have order or importance.

[0041] Such as Figure 1 to Figure 6 As shown, the present disclosure provides a glass substrate cutting machine, including a heating device 1 and a driving device 2, the heating device 1 is used to heat the cutting area of ​​the glass substrate 5, and the driving device 2 is used to drive the heating device 1 toward t...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The disclosure relates to a glass substrate cutting machine, comprising a heating device (1) and a driving device (2), the heating device (1) is used for heating the cutting area of ​​the glass substrate (5), and the driving device (2) is used for The heating device (1) is driven to move towards the cutting area or away from the cutting area. Through the above technical solution, the driving device (2) drives the heating device (1) to approach or stay away from the glass substrate (5) to heat the cutting area, so that the overall temperature of the cutting area can be kept uniform, and dust can be prevented from being caused by the cutting area during cutting. The temperature is uneven and aggregated to prevent dust from adhering to the surface of the glass substrate (5), thereby improving the quality of the glass substrate (5), reducing the wear of the cutting knife (6), and prolonging the service life of the cutting knife (6) .

Description

technical field [0001] The present disclosure relates to the technical field of glass substrates, in particular, to a glass substrate cutting machine. Background technique [0002] In the production process of liquid crystal glass substrates, the molten glass frit is overflowed and drawn into plates, and then cut into individual pieces by a cutting machine. In the prior art, the cutting knife directly cuts the annealed glass substrate. At this time, the cutting area of ​​the glass substrate presents a temperature distribution with low temperature at both ends and high temperature in the middle. Accumulated at the transition position between them, resulting in a large amount of glass dust attached to the surface of the glass substrate, and the attached glass dust cannot be eliminated in the subsequent cleaning and dust removal process of the glass substrate, seriously affecting the quality of the glass substrate. In addition, when the cutting knife cuts when the temperature ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C03B33/02
CPCC03B33/0207
Inventor 李青李赫然姚文龙何怀胜杨道辉刘源李冰汪曹胜李震李兆廷石志强
Owner WUHU TUNGHSU PHOTOELECTRIC SCI & TECHCO
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com